mfh systems E-NERGY CARBON BASIC TT 1200, Инструкция по установке и руководство по эксплуатации, Страница: 9 / 32

3.2.3 Installation methods
There are three different types of installation:
(A) Embedding the film between inorganic layers with dispersion fillers or dispersion plaster systems such as
Schönox FS, Brillux PM1881 or Maxit K+B.
(B) Bonding of the film between inorganic and organic layers with all types of flexible adhesives as
described under (A).
(C) Floating installation on floor and ceiling as top layer under the top layer.
In cases (A) - (B), the foil is to be worked in the thin-bed method in a moist adhesive bed without air bubbles. To
do this, apply the adhesive bed 1-2 mm thick to the substrate, then carefully press the foil into the still damp bed
with a plastic trowel. The copper contact strips always face the wall. After the heating foil has been glued in, a
complete covering layer (filler, plaster system, tile, etc.) of at least 2 mm must be applied. If several heating foils
are to be laid next to each other, it must be ensured that a minimum distance of 20 mm is maintained between the
individual foils.
It must be ensured that the foil is not laid over expansion joints.
If several heating strips are to be laid floating next to each other according to installation method (C), it must be
ensured that the heating strips are secured against slipping with adhesive tape and that a minimum distance of
20 mm is maintained between the individual foils. The heating tracks and copper contact strips must not touch
or cross each other when laid in multiple tracks. The ends/joints of the foil must always be taped with insulating
adhesive tape (even with uncut strips). For the installation of the controller and sensor, see section
Electrical
connection.
3.2.4. Installation under tiles
Before the tiles are bonded, the heating foil must be completely laid with flexible tile adhesive using a thin-bed
method and a 1-2 mm thick top layer. The surface must be dried according to the instructions of the adhesive
manufacturer. When laying several strips, ensure that the surface is level.
09
Notice Further information can be found in the QR code on the back
Sealings in wet areas are applied above the heating foil.
8
Für eine schwimmende Verlegung ohne Verklebung, z.B. zwischen
Estrich und Laminat, empfehlen wir, eine ca. 2 mm ausgleichende Kork-
schicht oder Glasfaservlies unter der Heizfolie zu verlegen.
3.2.2 Wärmedämmung
Eine Wärmedämmung im Boden und Wandbereich ist zu empfehlen,
um die Wärmeabgabe ins Mauerwerk und den Boden zu reduzieren.
Um den Wärmefluss nach unten zu begrenzen, ist folgendes Mindest-
verhältnis der Wärmedurchgangskoeffizienten des Fußbodenaufbaues
oberhalb der Dämmschicht und des Wärmedurchgangskoeffizienten
für alle Schichten unterhalb der Lastverteilschicht einzuhalten (nach EN
50559:2013-12):
• Zwischengeschossdecke, über beheizten Räumen:
U max: 1,25 W/(m
2
*K)
• Zwischengeschossdecken über teilweise beheizten Räumen:
U max: 0,75 W/(m
2
*K)
• Kellerdecken, Wände und Decken gegen unbeheizte Räume sowie
Decken und Wände, die an das Erdreich grenzen:
U max: 0,35 W/(m
2
*K)
Die Dämmschichten unter der Fußbodenkonstruktion sind nach fol-
gender Tabelle zu wählen. Mindest-Wärmedurchgangskoeffizienten
sind einzuhalten. Es dürfen nur genormte, für Fußbodenheizung geeig-
nete Dämmstoffe verwendet werden. Die Zusammendrückbarkeit der
Dämmschicht darf nicht mehr als 5 mm betragen. Bei mehreren Lagen
ist die Zusammendrückbarkeit der einzelnen Lagen zu addieren.
U
max
W/(m
2
*L)
R
min
m
2
*K/W
Zwischengeschossdecken über beheizten
Räumen
1,25 0,75
Zwischengeschossdecken über teilweise
beheizten Räumen
0,75 1,25
Heizflächen zwischen Außenluft oder Erdreich 0,35 2,86
Kellerdecken, Wände oder Decken gegen
unbeheizte Räume
0,35 2,86
Mindest-Wärmedurchgangskoeffizient und Mindest-Wärmeleitwider-
stand der Bauteile.
If the heating film is being installed without adhesive, e.g. between screed
and laminate, we recommend the inclusion of roughly 2 mm of a cork layer
or fibreglass matting underneath the heating film to compensate for this.
3.2.2 Heat insulation
Heat insulation in the floor and walls is recommended, in order to re-
duce the loss of heat to the walls and floor. To limit heat radiation down-
wards, the following minimum ratio of the heat transfer coefficient of
the floor structure above the insulation layer and the heat transfer coef-
ficient of all layers underneath the load distribution layer must be obser-
ved (according to EN 50559:2013-12):
• Intermediate ceilings, above heated rooms:
U max: 1.25 W/(m
2
*K)
• Intermediate ceilings, above rooms that are heated to some extent:
U max: 0.75 W/(m
2
*K)
• Cellar ceilings, walls and ceilings next to unheated rooms as well as
ceilings and walls adjacent to earth:
U max: 0.35 W/(m
2
*K)
The insulation layers below the floor structure must be chosen in ac-
cordance with the following table. Minimum heat transfer coefficients
must be observed. Standardised insulation materials that are suitable
for underfloor heating must be used. The insulation layer must not be
compressible by more than 5 mm. If there are several layers, the com-
pressibility of the individual layers is added together.
U
max
W/(m
2
*L)
R
min
m
2
*K/W
Intermediate ceilings above heated rooms 1.25 0.75
Intermediate ceilings above rooms that are
heated to some extent
0.75 1.25
Heating areas between outside air or earth 0.35 2.86
Cellar ceilings, walls or ceilings next to unhea-
ted rooms
0.35 2.86
Minimum heat transfer coefficient and minimum heat conductivity of
the components.
Wärmedämmung und Verlegung als Direktheizung im Dünnbettkleber Heat insulation and installation as direct heating in thin bed adhesive
Thermal insulation and laying as
direct heating in thin-bed adhesive.
Floor covering
Heating foil
Thin bed adhesive
Screed
Cover
Insulation layer
load-bearing floor