MeiVac MAK 1.3 inch, Руководство по эксплуатации и техническому обслуживанию владельца

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In order to increase sputtering rate, magnetic coils were sometimes placed around the chamber to
pinch the plasma during the deposition. The pressure was reduced to 20 microns (2 X 10
-2
torr)
and the rates increased. The electrodes were close together and the R.F. voltage was high.
These conditions caused damage to semiconductor devices due to the high electron and secon-
dary ion bombardment, which took place.
When it was realized how important the role of a magnetic field was in concentrating the plasma
and the effects that it had on rate, sputtering became more attractive as a commercial process.
Several magnetic configurations were used such as the post cathode, magnetically enhanced hol-
low cathodes and magnetrons. In order to make a magnetron work, it is necessary to cause the E
X B drift currents to close on themselves. This realization led to the magnetron cathode designs
that are in use today.
MAK BENEFITS
BENEFITS OF THE MAK
SIMPLICITY IN SPUTTERING
Magnetics
Center Magnet
Adjustable Anode Set
Screws
Ring Magnet Cathode
Balanced / Unbalanced
•
Magnet array is
INTERCHANGEABLE from bal-
anced or unbalanced. Disas-
sembly of source NOT
REQUIRED!
No Magnetic Housing
•
Provides higher magnetic den-
sity at target surface
•
Sputters at lower voltage for
comparable power levels
•
Standard MAK sputters mag-
netic material
Issued September 11, 2008 6