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Copper Backing Plate Specifications (See Appendix A)
Caution
Failure to use thermal contact paste or a thin metal foil as an interface layer between the
target and the copper cooling block can cause over heating and may damage the MAK
source and/or target.
Remove the Anode
Simplicity in Sputtering
MAK with target installed
Anode retracted
Target
mounted with
magnetic
keeper
1. Spread a small amount of thermal contact paste on the top of the copper chill
block. The paste should be spread evenly and so thin you can see through it.
a) If the thermal contact paste is not used a thermally and electrically conductive foil e.g.
indium ~0.005” thick with a donut shape slightly smaller than the cathode/chill block
must be placed between the block and the target.
b) Place the target at the center of the source assuring that the magnetic keeper has
been properly positioned in the recessed center magnet cavity. Twist slightly to
evenly distribute the thermal contact paste.
c) Replace Anode
NOTE: A target keeper is not required with magnetic materials; however, the user should take
care to insure even spacing between the O.D. of the target and the I.D. of the ground shield.
Thermal Contact Paste
Part Number TP-832
17
Содержание MAK 1.3 inch
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Страница 52: ...1 Simplicity in Sputtering INTRODUCING Planar Magnetron Sputtering Source The MAK...
Страница 53: ...2 Simplicity in Sputtering Target Installation on the MAK Target Keeper Cathode Magnets...
Страница 55: ...4 Simplicity in Sputtering MAK without target installed Target Keeper Cathode Adjustable Anode...
Страница 56: ...5 Simplicity in Sputtering MAK with target installed Target mounted with magnetic keeper Anode retracted...