MeiVac MAK 1.3 inch, Руководство по эксплуатации и техническому обслуживанию владельца

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TARGET PARAMETERS
Purity
Target material for the MAK sputtering source is not confined to a minimum or maximum purity
level. This parameter is dependent upon film requirements.
Surface
The mounting (bottom side) surface of the target should be smooth and flat to allow good contact
to source. The top and bottom of the target should be parallel for best deposition uniformity.
Target Dimensions
See the Target Specifications at www.us-incorp.com .
[1.3” MAK] [2.0” MAK] [3.0” MAK] [4.0” MAK] [6.0” MAK]
Target Suppliers – For a list of qualified target suppliers, see Appendix B.
Simplicity in Sputtering
INTRODUCING
The MAK
Planar Magnetron Sputtering Source
TARGET KEEPER
Target Installation on the MAK
The MAK sputtering sources
have the unique feature of
attaching the target using
magnetic force. This is
accomplished by attaching a
magnetically permeable
“keeper” (see appendix) to the
Cathode
Target
bottom of the target. This
keeper coupling with the mag-
netic field of the MAK source
provides sufficient force to
clamp and center the target,
eliminating the need for com-
plex mechanical clamps.
Keeper
Magnets
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