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MAGNETRON SPUTTERING  

 
Observations of the phenomenon we now call sputtering, go back over one hundred years to early 
experiments which introduced electricity into a reduced pressure atmosphere.  L. Holland de-
scribes these beginnings in his book Vacuum Deposition of Thin Films.
 
“When an electrical discharge is passed between electrodes at a low gas pressure, the cathode 
electrode is slowly disintegrated under the bombardment of the ionized gas molecules.  This phe-
nomenon is termed cathodic sputtering.  The disintegrated material leaves the electrode surface 
either as free atoms or in chemical combination with the residual gas molecules.  Some of the lib-
erated atoms are condensed on surfaces surrounding the cathode while the remainder are re-
turned to the cathode by collision with gas molecules.” 
 
The ensuing process might be compared to a fine sand blasting in which the momentum of the 
bombarding particles is more important than their charge.  The inert gas argon was chosen, to act 
as the sputtering medium, because it is a heavy rare gas and is plentiful.  It also has a low ioniza-
tion potential.  The inert nature of argon inhibits compounds from being formed at the target sur-
face. 
 
Once sputtered, the target atoms travel until they reach a nearby surface most notably, the sub-
strate.  The deposited layer forms or grows on the substrate structure, influenced by such things as 
material, temperature and gas structure. 

 

When the ions strike the target, their primary electrical charge is neutralized (gain back the lost 
electron) and they return to the process as atoms.  Thus, direct current sources generally prevail 
as the electrical energy source. 

 

Issued 

September 11, 2008

 

5

Содержание MAK 1.3 inch

Страница 1: ...138 PH 408 362 1000 FX 408 362 1010 E MAIL support meivac com YOUR S N _____________________________ WARNING AS WITH ALL ELECTRICAL DEVICES THERE IS A SHOCK HAZARD ASSOCIATED WITH THIS DEVICE ALL INST...

Страница 2: ...AMOUNT MUST BE APPLIED A GLOVED FINGER USED TO SPREAD EVENLY OVER THE CATHODE BLOCK The block should be clearly visible thru a thin gray film NOTE A substitute paste such as thin 0 005 Indium foil can...

Страница 3: ...meters 14 PURITY 14 SURFACE 14 TARGET DIMENSIONS 14 TARGET SUPPLIERS 14 MACHINABLE MATERIALS 15 NON MACHINABLE MATERIALS 16 Target Mounting 16 Rate vs Power 18 Relative Sputtering Rates of 50 Material...

Страница 4: ...shipment throughout the world INTRODUCING MAK SPUTTER SOURCES The MAK sputter sources were designed developed tested under controlled laboratory condi tions at a major United States government labora...

Страница 5: ...r are re turned to the cathode by collision with gas molecules The ensuing process might be compared to a fine sand blasting in which the momentum of the bombarding particles is more important than th...

Страница 6: ...as a commercial process Several magnetic configurations were used such as the post cathode magnetically enhanced hol low cathodes and magnetrons In order to make a magnetron work it is necessary to c...

Страница 7: ...This meant high voltage with current draw being limited by the gas pressure Typical voltages were 3 5 kV with a current from 50 250 ma at pressures of 50 250 microns R F power was introduced be cause...

Страница 8: ...ith suitable gauging to measure and monitor pressures in the 0 5 600 micron range during sputtering and the 1x10 5 to 1x10 9 torr range during pre sputter pump down The system must also be equipped wi...

Страница 9: ...e will decrease by the square of the distance from source to sub strate however uniformity will be enhanced as this distance is increased The chamber may be made of glass or metal If the chamber is me...

Страница 10: ...the end of the tube 2 Pull straight out on the electrical connector mounting assembly The whole assembly will come off leaving the water tubes free and the electrical connector assembly unplugged fro...

Страница 11: ...See technical specifications for minimum flow requirements 10 Connect the power cable B DIRECT FLANGE MOUNTING VIA CF ISO ANSI JIS and other flanges 1 MAK Source has been attached to the mounting flan...

Страница 12: ...ork P N SU R1001 1000 Watt RF Generator and Automatic Tuning Network DC Connection The power supply is provided with twelve feet of RG 8 U high voltage cable Connect the PL 259 connector to the power...

Страница 13: ...UTTERING CAUTIONS IN RF HOOK UP Cable length between should be a derivative of the 13 56 MHz Wave length Approximately 48 24 or 12 feet and be 50 ohm RF shielded cable Cable length between the tuning...

Страница 14: ...3 0 MAK 4 0 MAK 6 0 MAK Target Suppliers For a list of qualified target suppliers see Appendix B Simplicity in Sputtering INTRODUCING The MAK Planar Magnetron Sputtering Source TARGET KEEPER Target In...

Страница 15: ...MAK MACHINABLE MATERIALS By attaching a magnetic keeper to the target the MAK source uses the magnetics of the gun to hold the target in place If you have old targets NO PROBLEM Drill and tap your exi...

Страница 16: ...tapped hole Backing Plates Ceramics oxides and any other non ma chinable targets are commonly bonded to a copper backing plate for all sputtering sources MAK Backing Plates The MAK sputter source use...

Страница 17: ...Spread a small amount of thermal contact paste on the top of the copper chill block The paste should be spread evenly and so thin you can see through it a If the thermal contact paste is not used a t...

Страница 18: ...onvenient and readily available material to use as a reference Once the rate of copper is known then the other 49 may be approximated Please Note These rates may vary from those of other periodicals d...

Страница 19: ...is to correlate the values taken with the rate monitor with those taken by step sample method If the distance from the substrate to the target is changed and the power remains constant the change in d...

Страница 20: ...return any defective units prepaying the freight costs and ensuring that the units are returned to the location identified by MeiVac on the RMA Provided the work required on the unit is covered under...

Страница 21: ...00 0 080 0 437 Target Volume max ccm cu inch 4 90 0 30 19 25 1 17 72 47 4 42 154 00 9 40 463 00 28 25 Target Surface Area cm sq sq in 8 56 1 33 20 27 3 14 45 60 7 07 81 10 12 56 182 4 28 25 ELECTRICAL...

Страница 22: ...D MECHANICAL Max OD mm inch 59 70 2 350 59 70 2 350 85 80 3 378 104 80 4 125 170 80 6 725 Smallest Mounting Flange CF ISO 4 1 2 DN63 NW 63 4 1 2 DN 63 NW 63 6 DN 100 NW 100 6 3 4 DN125 NW 160 10 DN200...

Страница 23: ...m Tico Titanium 52900 Grand river New Hudson MI 48165 Mr J P Cruzen PH 800 521 4392 FX 248 446 1995 www ticotitanium com Process Materials Inc 5625 Brisa Street Suite A Livermore CA 94550 Steve Verley...

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Страница 44: ...g Magnet L130 09 Stainless Steel Ground Shield L130A14 Block Assembly J1200 06 Center Magnet J1200 33 O Ring J1200 34M Metal Seals J1234 30 Water Lines 2 w ferrules LL 130 01 Keeper w hole screw pkg 1...

Страница 45: ...00 10 Aluminum Ground Shield L200A14 Block Assembly J1200 06 Center Magnet J1200 33 O Ring J1200 34M Metal Seals J1234 30 Water Lines 2 w ferrules LL 200 01 Keeper w hole screw pkg 10 MAK 200 BP Coppe...

Страница 46: ...ONLY L300 10NT Aluminum Ground Shield L300 13 Center Magnet L300 24 Ring Magnet L300A14 Block Assembly J3400 33 O Ring J3400 34M Metal Seals J1234 30 Water Lines 2 w ferrules LL 300 01 Keeper w hole...

Страница 47: ...net Assembly L400A14 Block Assembly J4600 13 Center Magnet J4600 32 Ring Magnet Segment 10 31 25 each J3400 33 O Ring J3400 34M Metal Seals J1234 30 Water Lines 2 w ferrules LL 400 01 Keeper w hole sc...

Страница 48: ...t Plug L600 41 O Ring L600A14 Block Assembly L600A20 Center Magnet Assembly J4600 13 Center Magnet J4600 32 Ring Magnet Segments 16 31 25 each L600 42 Water Lines 2 w ferrules LL 600 01 Keeper w hole...

Страница 49: ...g cooling all components except small cathode area are at ground or neutral potential Cathode Cooling Block Magnet Return AlN Water Line Power Feedthru Water Line Passage for Insulated Power Post Cool...

Страница 50: ...voltage for comparable power levels Standard MAK sputters magnetic material Balanced Unbalanced Magnet array is INTERCHANGEABLE from balanced or unbalanced Disassembly of source NOT REQUIRED BENEFITS...

Страница 51: ...tor permits RF DC operation One Vacuum Seal Elastomer HV or Metal UHV field interchangeable No water to Vacuum Seal No Mechanical Target Clamp Target surface is not in contact with dissimilar clamping...

Страница 52: ...1 Simplicity in Sputtering INTRODUCING Planar Magnetron Sputtering Source The MAK...

Страница 53: ...2 Simplicity in Sputtering Target Installation on the MAK Target Keeper Cathode Magnets...

Страница 54: ...mounted by attraction of the center magnet No mechanical clamping of the target THUS Ease of target change Adjustable anode THUS Allows for target thickness variations Prevents material build up Stan...

Страница 55: ...4 Simplicity in Sputtering MAK without target installed Target Keeper Cathode Adjustable Anode...

Страница 56: ...5 Simplicity in Sputtering MAK with target installed Target mounted with magnetic keeper Anode retracted...

Страница 57: ...6 Simplicity in Sputtering The MAK with target and anode Anode adjusted to accommodate thicker target Target Slotted anode allows for variable target thickness...

Страница 58: ...7 Simplicity in Sputtering MAK target installed w o anode Target 0 100 gap between target and magnets Magnet segments...

Страница 59: ...to a copper backing plate for all sputtering sources MAK Backing Plates The MAK sputter source uses the same backing plate but with a magnetic keeper attached The keeper holds the target in place with...

Страница 60: ...et Example This is an example of a SiO2 target bonded to a copper backing plate with a magnetic keeper attached target keeper bond copper backing plate TARGET MOUNTING OF THE MAK NON MACHINABLE MATERI...

Страница 61: ...ou have old targets NO PROBLEM Drill and tap your existing targets as shown and attach the metallic keeper Then snap the target into place It s that simple TARGET MOUNTING OF THE MAK MACHINABLE MATERI...

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