MeiG_SLM550_Hardware Design Manual
MeiG Smart Technology Co., Ltd
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After unpacking, the SMT patch should be taken within 168 hours under ambient conditions of <30
℃
and relative humidity <60%. If the above conditions are not met, baking is required. Note: Oxidation
risk: Baking SMD packages can cause metal oxidation and, if excessive, can cause solderability
problems during board assembly. The temperature and time of the SMD package are baked, thus
limiting solderability considerations. The accumulation of baking time should be no more than 96 hours
at temperatures above 90°C and as high as 125°C
7.4 Baking Requirements
Due to the humidity sensitivity of the module, the SLM550 should be thoroughly baked prior to reflow
soldering, otherwise the module may cause permanent damage during reflow soldering. The SLM550
should be baked for 192 hours in a cryogenic vessel at 40°C +5°C/-0°C and a relative humidity of less
than 5%, or in a high temperature vessel at 80°C±5°C.Bake for 72 hours. Users should note that the
tray is not resistant to high temperatures. The user should take the module out of the tray for baking,
otherwise the tray may be damaged by high temperature.
Table 33 Baking requirements:
Baking temperature
Humidity
Baking time
40°C±5°C
<5%
192 hours
120°C±5°C
<5%
4 hours
