MeiG_SLM550_Hardware Design Manual
MeiG Smart Technology Co., Ltd
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MIC_BIAS2
155
O
The BIAS voltage of the
earphone MIC is used in the
design of silicon wheat
CDC_HPH_R
136
O
Right channel of earphone
CDC_HPH_L
138
O
Left channel of earphone
CDC_HSDET_L
139
I
Headphone plug and unplug
detection
CDC_HPH_REF
137
I
Earphone reference GND
EAR_P
8
O
Earpiece output negative
EAR_M
9
O
Earpiece output positive
LINE_OUT_P
10
O
Power amplifier output
negative
Class_D
LINE _OUT_M
11
O
Power amplifier output
positive
Class_D
SD card Interface
GPIO80_SD_CARD_
DET_N
45
I/O
SD card insertion detection
SDC2_SDCARD_CM
D
40
I/O
SD CMD
SDC2_SDCARD_CLK 39
I/O
SD clock
SDC2_SDCARD_D0
41
I/O
SD data
SDC2_SDCARD_D1
42
I/O
SDC2_SDCARD_D2
43
I/O
SDC2_SDCARD_D3
44
I/O
I2C
GPIO29_CAM_I2C_S
DA0
84
I/O
Special I2C signal can only
be used for CAM
Pullup to
VREG_L15_1P8
GPIO30_CAM_I2C_S
CL0
83
I/O
GPIO22_DCAM_I2C_
SDA1
205
I/O
Default for DCAM
GPIO23_DCAM_I2C_
SCL1
166
I/O
GPIO109_SENSOR_I
2C_SDA
92
I/O
Special I2C signal can only
be used for SENSOR
GPIO110_SENSOR_I
2C_SCL
91
I/O