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MEIG SLM550, Руководство по конструкции аппаратуры

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MeiG_SLM550_Hardware Design Manual

MeiG Smart Technology Co., Ltd

47/89

MIPI_DSI0_LANE3_M

60

I/O

MIPI_DSI0_LANE3_P

61

I/O

MIPI_DSI0_LANE2_M

58

I/O

MIPI_DSI0_LANE2_P

59

I/O

GPIO82_LCD_RESET_N

49

O

LCD  reset pin

GPIO81_LCD_TE0

50

I/O

LCD frame sync signal

VREG_L20_2P85

129

O

2.8V power supply

LCD_ID of the module, this pin is internally GPIO. When used as LCD_ID, please confirm the internal 
circuit of LCD. If the internal divider of the LCD uses resistor divider, please pay attention to the voltage 
to meet the high or low range of GPIO.

MIPI  is  a  high-speed  signal line.  To  avoid  EMI  interference,  it is  recommended  to  place  a  common-
mode inductor near the LCD side.

Figure 23  LCD interface circuit

Содержание SLM550

Страница 1: ...MeiG_SLM550_Hardware Design Manual MeiG Smart Technology Co Ltd 1 89 MeiG SLM550 Hardware Design Manual Released Date 2022 07 20 Version Number V1 02...

Страница 2: ...no responsibility for the merchantability and fitness for a particular purpose or any indirect extraordinary or consequential losses Confidentiality Claim The information contained in this document in...

Страница 3: ...tribution diagram 2 The capacity of TF card is modified to support 256GB at most 3 Update the pin characteristics table V1 02 2022 07 20 1 Add multiplexing function Table 43 2 Update microphone receiv...

Страница 4: ...MeiG_SLM550_Hardware Design Manual MeiG Smart Technology Co Ltd 3 89 SLM550 Hardware Design Guide_V1 02...

Страница 5: ...n method The company does not assume responsibility for property damage or personal injury caused by improper operation of the user Users are requested to develop the corresponding products according...

Страница 6: ...nce that may cause undesired operation FCC standards Antenna Gain BT 2 4G Wifi 2 2dBi 5G wifi 2 52dBi GSM GPRS EGPRS 850 3 52dBi GSM GPRS EGPRS 1900 3 58dBi WCDMA Band V 3 52dBi WCDMA Band II 3 58dBi...

Страница 7: ...t may cause undesired Any company of the host device which installs this modular with unlimited modular approval should perform the test of radiated conducted emission and spurious emission etc accord...

Страница 8: ...limits as appropriate Les dispositifs fonctionnant dans la bande 5150 5250 MHz sont r serv s uniquement pour une utilisation l int rieur afin de r duire les risques de brouillage pr judiciable aux sy...

Страница 9: ...le Shutdown 39 4 2 3 Module Reset 39 4 3 VCOIN Power 40 4 4 Power Output 41 4 5 Serial Port 42 4 6 MIPI Interface 44 4 6 1 LCD Interface 44 4 6 2 MIPI Camera Interface 46 4 7 Capacitive Touch Interfac...

Страница 10: ...Interface Features 70 6 5 SIM_VDD Characteristics 70 6 6 PWRKEY Feature 70 6 7 VCOIN Feature 71 6 8 Current Consumption VBAT 3 8V 71 6 9 Electrostatic Protection 72 6 10 Module Operating Frequency Ban...

Страница 11: ...erface of the module including the connection of the circuit and the RF interface It can help users quickly understand the interface definition electrical performance and structural dimensions of the...

Страница 12: ...34 39 CDMA BC0 EVDO BC0 TDD LTE B38 40 41 FDD LTE B1 3 5 7 8 20 28A WCDMA B1 5 8 GSM 2 3 5 8 FDD LTE B2 4 5 7 12 13 17 25 26 66 WCDMA B2 4 5 8 GSM B2 5 The physical interface of the module is a 274 pi...

Страница 13: ...A 3 1 1 8Mbps EDGE Class12 236 8kbps 236 8kbps GPRS Class12 85 6kbps 85 6kbps SIM DSDS Dual Sim card Dual Stanby 3 0 1 8V Support SIM hot plug L W G G with CSFB to W G L TDS G G with CSFB to TDS G L...

Страница 14: ...B boot for emergency downloads QUP ports 10ports x4 in LPI UART 3 Max up to 4 Mbps I2C 5 Support SPI master only Support ADC 1 Support PWM 1 Support Charge Max up to 2A Vibrator Support GPIO 40 GPIOs...

Страница 15: ...chip AUDIO interface UART SD card interface SIM card interface I2Cinterface etc QCM2290 Baseband PM4125 PMIC WTR2965 Transceiver 16EM16 M4CTB29 GA70 eMCP PA PAM LNA Switch ANT_MAIN ANT_DIV ANT_GNSS V...

Страница 16: ...40 241 239 211 209 210 208 173 171 172 170 186 185 184 183 182 181 180 179 178 177 157 158 159 160 161 162 163 164 165 166 MIC1_P MIC_GND MIC2_P GND EAR_P EAR_N LINE_OUT_P GND USB_DM LINE_OUT_N USB_DP...

Страница 17: ...is absent the external backup battery provides power to the system real time clock When VBAT is present the backup battery is charged VCOIN pins connect 3V button batteries or large capacitors L15_1P8...

Страница 18: ...9 261 266 268 269 271 274 display interface MIPI DSI_CLK_N 52 I O MIPI_LCD clock DSI_CLK_P 53 I O DSI_LN0_N 54 I O MIPI_LCD data DSI_LN0_P 55 I O DSI_LN1_N 56 I O DSI_LN1_P 57 I O DSI_LN2_N 58 I O DSI...

Страница 19: ...T2 Request To Send RTS UIM card Interface GPIO79_UIM1_DET 22 I UIM1 insert detect UIM1_RESET 23 O UIM1 reset UIM1_CLK 24 O UIM1 clock UIM1_DATA 25 I O UIM1 data GPIO75_UIM2_DET 17 I UIM2 insert detect...

Страница 20: ...Camera MIPI data CSI1_LN0_P 66 I O CSI1_LN1_N 67 I O CSI1_LN1_P 68 I O CSI1_LN2_N 72 I O CSI1_LN2_P 73 I O CSI1_LN3_N 70 I O CSI1_LN3_P 71 I O GPIO21_MCAM_MCL K1 74 I O Rear Camera main clock GPIO19_M...

Страница 21: ...lifier output negative Class_D LINE _OUT_M 11 O Power amplifier output positive Class_D SD card Interface GPIO80_SD_CARD_ DET_N 45 I O SD card insertion detection SDC2_SDCARD_CM D 40 I O SD CMD SDC2_S...

Страница 22: ...P_INT_N GPIO80_TP_I NT_N I TP interrupt GPIO71_TP_RESET_ N GPIO71_TP_ RESET_N O TP reset USB USB_HS_DM 13 I O USB DM USB_HS_DP 14 I O USB DP USB_HS_ID 16 I USB ID Antenna interface RF_MAIN 87 I O The...

Страница 23: ...M I2C GPIO22_DCAM_I2C_ SDA1 205 I O Default configuration Depth CAM I2C GPIO20_DCAM_MCL K 165 I O Default configuration Depth CAM MCLK GPIO18_DCAM_RST 164 I O Default configuration Depth CAM Reset GPI...

Страница 24: ...configuration GPIO102 90 I O Generic GPIO without default configuration GPIO31 97 I O Generic GPIO without default configuration GPIO62_RFFE5_CLK 260 I O GRFC only used for RF Tuner control not for g...

Страница 25: ..._DRV_P 28 O Motor positive control ADC 128 I Analog voltage input can be used as ADC input PWM 29 O Analog voltage input can be used as PWM input optional NFC_CLK 181 O NFC Clock NFC_CLK_REQ 182 I Def...

Страница 26: ...arpiece output plus 9 EAR_M AO Earpiece output minus 10 LINE_OUT_P AO Class D speaker driver output plus 11 LINE_OUT_M AO Class D speaker driver output minus 12 GND GND GND 13 USB_HS_DM AI AO USB data...

Страница 27: ...ukp Configurable I O UART5 TX 35 GPIO70_UART2_RX D GPIO70 B PD nppukp Configurable I O UART5 RX 36 GPIO4_UART2_CTS GPIO4 B PD nppukp Configurable I O UART5 CTS 37 GPIO5_UART2_RTS GPIO5 B PD nppukp Con...

Страница 28: ...display serial interface 0 lane1 57 MIPI_DSI0_LANE1_ P AI AO MIPI display serial interface 0 lane1 58 MIPI_DSI0_LANE2_ M AI AO MIPI display serial interface 0 lane2 59 MIPI_DSI0_LANE2_ P AI AO MIPI d...

Страница 29: ...p Configurable I O main CAM PWDN 81 GPIO24_SCAM_RST _N GPIO24 B PD nppukp Configurable I O front CAM RESET 82 GPIO26_SCAM_PW DN GPIO26 B PD nppukp Configurable I O front CAM PWDN 83 GPIO30_CAM_I2C_S C...

Страница 30: ...gurable I O 105 GPIO_39 GPIO_39 B PD nppukp Only Configurable Out 106 GPIO_38 GPIO_38 B PD nppukp Only Configurable Out 107 GPIO35_ALSP_INT_ N GPIO35 B PD nppukp Configurable I O ALSP INT 108 GPIO32_G...

Страница 31: ...er select 128 ADC AO Z AI DO Configurable MPP PWM ADC 129 VREG_L20_2P85 PO PMIC output 2 8V for LCD CAM 130 GND GND GND 131 RF_DIV AI RF signal for diversity ANT 132 PACK_VSNS_M GND GND 133 VBAT_SNS_P...

Страница 32: ...MIC output 3 0V for TP Sensor 157 MIPI_CSI0_CLK_M AI AO MIPI camera serial interface 0 clock 158 MIPI_CSI0_LANE0_ M AI AO MIPI camera serial interface 0 lane0 159 MIPI_CSI0_LANE1_ M AI AO MIPI camera...

Страница 33: ...73 FLASH_LED1 Reserved 174 NC Reserved 175 NC Reserved 176 GND GND GND 177 GPIO90 GPIO90 B PD nppukp Configurable I O 178 MIC1_INM Reserved 179 MIC2_INM Reserved 180 MIC3_INM Reserved 181 NFC_CLK DO N...

Страница 34: ...1_ P AI AO MIPI camera serial interface 0 lane1 199 MIPI_CSI0_LANE2_ P AI AO MIPI camera serial interface 0 lane2 200 MIPI_CSI0_LANE3_ P AI AO MIPI camera serial interface 0 lane3 201 GPIO111 GPIO111...

Страница 35: ...223 GND GND GND 224 GND GND GND 225 RESET_N DI KEY RESET 226 GND GND GND 227 GND GND GND 228 GND GND GND 229 GND GND GND 230 GND GND GND 231 GND GND GND 232 USB0_SS_TX1_P Reserved 233 GND GND GND 234...

Страница 36: ..._SS_TX0_P Reserved 253 USB0_SS_RX0_M Reserved 254 USB0_SS_RX0_M Reserved 255 GND GND GND 256 GND GND GND 257 USB0_SS_TX1_M Reserved 258 GND GND GND 259 GND GND GND 260 GPIO62_RFFE5_CL K GPIO62 B PD np...

Страница 37: ...GND 274 GND GND GND Wake up system interrupt pin B Bidirectionaldigital with CMOS input H High voltage tolerant NP pdpukp defaultno pull with programmable options following the colon PD nppukp defaul...

Страница 38: ...MeiG_SLM550_Hardware Design Manual MeiG Smart Technology Co Ltd 37 89 Figure 6 Module 3D size unit mm Figure 7 Recommended PCB package size unit mm...

Страница 39: ...l 33PF and 10PF capacitors can effectively remove high frequency interference To prevent damage to the chip due to ESD and surge it is recommended to use a suitable TVS tube and a 5 1V 500mW Zener dio...

Страница 40: ...damaged When using a battery the impedance between the VBAT pin and the battery should be less than 150m 4 1 1 Power Pin The VBAT pin 1 2 145 146 is used for power input In the user s design pay spec...

Страница 41: ...CBL_PWR_N can be powered on by 10K pull down resistor to GND It does not need to release this signal after booting Figure 12 Using an external signal to drive the module to boot Figure 13 Booting wit...

Страница 42: ...up on the screen to confirm whether to perform the shutdown action The user can achieve a forced shutdown by pulling PWRKEY down for a long time pulling down for at least 15 seconds 4 2 3 Module Rese...

Страница 43: ...fective time 500 ms 4 3 VCOIN Power When VBAT is disconnected the user needs to save the real time clock The VCOIN pin cannot be left floating It should be connected to a large capacitor or battery Wh...

Страница 44: ...50 has multiple power outputs For LCD Camera touch panel etc In application it is recommended to add parallel 33PF and 10PF capacitors to each power supply to effectively remove high frequency interfe...

Страница 45: ...or can be added Table 6 UART Pin Description Name Pin Direction Function GPIO2_UART1_TXD 154 I UART1 Data Transmission GPIO3_UART1_RXD 153 O UART1 Data Reception GPIO12_DBG_UART_TX 94 I UART2 Data Tra...

Страница 46: ...n TX and RX are listed here Other low speed signals can refer to this two circuits Figure 21 TX Connection Diagram Figure 22 RX Connection Diagram Note When using Levels Isolation in Figures 14 and 15...

Страница 47: ...differential pair within the group and the group length The total length should be as short as possible 4 6 1 LCD Interface The SLM550 module Support 1 set of MIPI interface for LCD display and has a...

Страница 48: ...ignal VREG_L20_2P85 129 O 2 8V power supply LCD_ID of the module this pin is internally GPIO When used as LCD_ID please confirm the internal circuit of LCD If the internal divider of the LCD uses resi...

Страница 49: ...port up to 13M pixels The front camera is a CSI0 interface that supports four sets of data lines and can support 5M pixels The module provides the power required by the Camera including AVDD 2 8V IOVD...

Страница 50: ...A0 84 I O I2C data GPIO30_CAM_I2C_SCL0 83 I O I2C clock Extra LDO 1 8V IOVDD VREG_L20_2P85 129 O 2 8V AFVDD Extra LDO 2 8V AVDD Extra LDO 1 2V DVDD Extra LDO 1 2V DVDD Sub camera interface Name Pin In...

Страница 51: ...gns to use the CAMERA module with autofocus function please note that the I2C of the module cannot be directly connected to the AF device The I2C of the AF device should be connected to the driver chi...

Страница 52: ...MeiG_SLM550_Hardware Design Manual MeiG Smart Technology Co Ltd 51 89 Figure 26 MIPI Camera Reference Circuit...

Страница 53: ...w Figure 27 Camera imaging diagram 4 7 Capacitive Touch Interface The module provides a set of I2C interfaces that can be used to connect capacitive touches while providing the required power and inte...

Страница 54: ...me Pin Input Output Description MIC_IN1_P 4 I Main MIC positive MIC_IN2_P 6 I Headphone MIC positive MIC_GND 5 I Headphone MIC Headphone MIC noise reduction MIC negative MIC_IN3_P 148 I Headphone MIC...

Страница 55: ...s are advised to use the following circuit according to the actual application to get better sound effects 4 8 1 Receiver Interface Circuit Figure 28 Receiver Interface Circuit 4 8 2 Microphone receiv...

Страница 56: ...etection circuit the connection method in the above figure because HPH_L has a pull down resistor inside the chip which can ensure that HS_DET is low when connected with HPH_L if the user will HS_DET...

Страница 57: ...s detected first and then the DM DP pull up state is detected to determine whether the USB data line or the charger is inserted Therefore if you need to use the USB function please be sure to connect...

Страница 58: ...MeiG_SLM550_Hardware Design Manual MeiG Smart Technology Co Ltd 57 89...

Страница 59: ...charging related content of this manual is only described by the internal charging scheme The QCM2150 platform uses the Qualcomm PM215 internal integrated charging chip by default The chip is in liner...

Страница 60: ...AT voltage is lower than 3 4V the module is pre charged when VBAT is between 3 4V and 4 2V it is charged by the constant current plus constant voltage method optimized for the lithium battery At prese...

Страница 61: ...ndby Support SIM card hot swap can automatically recognize 1 8V and 3 0V cards The figure below is the SIM recommended interface circuit In order to protect the SIM card it is recommended to use TVS d...

Страница 62: ...ve hardware I2C bus interfaces include two camera specific CCI interface The pin definitions and default functions are as follows Table 14 I2C Interface Pin Description Name Pin Default function GPIO1...

Страница 63: ...s two MPP function signals from the power management chip PWM 29PIN and ADC 128PIN MPP can be configured as an ADC or PWM signal The ADC signal is 16 bit resolution and its performance parameters are...

Страница 64: ...products have good wireless performance the antenna selected by the user should meet the requirement that the input impedance is 50 ohms in the working frequency band and the VSWR is less than 2 4 17...

Страница 65: ...figure R101 defaults to 0R and C101 and C102 do not paste by default 4 17 2 DRX Antenna The module provides the DRX antenna interface pin RF_DIV and the antenna on the user s motherboard should be con...

Страница 66: ...ld be connected to the antenna pin of the module using a 50 ohm characteristic microstrip line or strip line The LNA is integrated inside the module To improve GNSS reception performance customers can...

Страница 67: ...r the antenna factory debugs the antenna Among them R301 defaults to 0R C301 and C302 do not paste by default If there are fewer components between the antenna and the module output or if the RF test...

Страница 68: ...much higher than the previous 2G module please read this chapter carefully reduce the subsequent hardware debugging cycle When using the SLM550 module the user is required to use at least 4 layers of...

Страница 69: ...ay attention to it The SIM_CLK signal is protected and the SIM_DATA SIM_RST and SIM_VDD signals of the SIM card are away from the power source and away from the high speed signal line If the processin...

Страница 70: ...on the path of the trace Table 16 Internal USB cable length of the module Pin Signal Length mm Length Error P N 14 USB_HS_DP 33 0 0 3mm 13 USB_HS_DM 33 3 5 2 6 Audio The module supports 3 analog audio...

Страница 71: ...conducted interference is also strongly related to TDD and GND If GND is not handled well many high frequency interference signals will interfere with MIC and Speaker through devices such as bypass c...

Страница 72: ...bsolute Maximum Parameter Minimum Typical Maximum Unit VBAT 6 V VBUS 10 5 V Peak current 3 A 6 2 Working Temperature The table below shows the operating temperature range of the module Table 18 Module...

Страница 73: ...Input low level voltage 0 63 V VOH Output high level voltage 1 35 V VOL Output low level voltage 0 45 V 6 5 SIM_VDD Characteristics Table 21 SIM_VDD Characteristics Parameter Description Minimum Typi...

Страница 74: ...eter Description Condition Minimum Typical Maximum Unit VBAT voltage Voltage must be between the maximum and minimum values 3 4 3 8 4 2 V Ivbat Average current Shutdown mode TBD uA GSM Standby power c...

Страница 75: ...complies with the 3GPP TS 05 05 technical specification Table 25 Module Operating Band Frequency band Receive Transmission Physical channel GSM850 869 894MHz 824 849MHz 128 251 EGSM900 925 960MHz 880...

Страница 76: ...0 38649 LTE B40 2300 2400 MHz 2300 2400 MHz 38650 39649 LTE B41 2496 2690 MHz 2496 2690 MHz 39650 41589 Note The SLM550 s LTE TDD B41 band bandwidth is 100MHz 2555 2655 MHz the channel is 40040 41240...

Страница 77: ...3GPPrequirements WCDMAB1 109 dBm 3GPPrequirements WCDMAB5 109 dBm 3GPPrequirements CDMABC0 110 dBm 3GPPrequirements TDSCDMA1 9G 110 dBm 3GPPrequirements TDSCDMA2G 110 dBm 3GPPrequirements LTEFDD TDD S...

Страница 78: ...95 27 FDD 19 100 97 95 2 FDD 20 97 94 91 2 90 FDD 21 100 97 95 2 FDD 22 97 94 92 2 91 FDD 23 104 7 101 7 100 97 95 2 94 FDD 24 100 97 FDD 25 101 2 98 2 96 5 93 5 91 7 90 5 FDD 26 102 7 99 7 97 56 94...

Страница 79: ...on Transmission performance 2 4G 802 11B 802 11G 802 11N Transmit power minimum rate 19 16 5 15 dBm Transmit power maximum rate 18 14 5 13 dBm EVM maximum rate 20 27 30 dB Receiving performance 2 4G R...

Страница 80: ...le 30 Main RF performance parameters under BT conduction Transmission performance Transmit power DH5 2DH5 3DH5 10 6 6 dBm Receiving performance Receiving sensitivity DH5 2DH5 3DH5 94 5 94 5 86 dBm 6 1...

Страница 81: ...MeiG_SLM550_Hardware Design Manual MeiG Smart Technology Co Ltd 80 89 7 Production 7 1 Top And Bottom Views Of The Module Figure 45 Module top and bottom views...

Страница 82: ...of temperature 30 and relative humidity 60 Under ambient conditions of temperature 40 and relative humidity 90 the shelf life is at least 6 months without unpacking After unpacking Table 22 lists the...

Страница 83: ...6 hours at temperatures above 90 C and as high as 125 C 7 4 Baking Requirements Due to the humidity sensitivity of the module the SLM550 should be thoroughly baked prior to reflow soldering otherwise...

Страница 84: ...le 35 Support for Camera Model List Vendor Drive IC Specification Sunny S5K3M2XX 13M Sunny S5K4H7 8M Sunny S5K5E8 5M Table 36 Support for touch screen model list Vendor Drive IC Specification GOODiX G...

Страница 85: ...MeiG Smart Technology Co Ltd 84 89 Table 39 Support PS ALS Sensor Model List Vendor Model Specification LITEON LTR 553ALS 01 ALS PS Table 40 Support for Gyro Sensor Model List Vendor Model Specificati...

Страница 86: ...ations system Phase 2 Specification of the SIM Application Toolkit for the Subscriber Identity Module Mobile Equipment SIM ME interface 5 GSM 11 11 Digital cellular telecommunications system Phase 2 S...

Страница 87: ...Packet Radio Service GSM Global Standard for Mobile Communications HR Half Rate IMEI International Mobile Equipment Identity Li ion Lithium Ion MO Mobile Originated MS Mobile Station GSM engine also r...

Страница 88: ...ed Supplementary Service Data Phone book abbreviation Explanations FD SIM fix dialing phonebook LD SIM last dialing phonebook list of numbers most recently dialed MC Mobile Equipment list of unanswere...

Страница 89: ...973 96 SPI_MOSI UART_RTS I2C_SCL GPIO_124 94 SPI_SCLK UART_TXD GPIO_134 93 SPI_CS_N UART_RXD GPIO_14 118 SPI_MISO UART_CTS I2C_SDA GPIO_15 119 SPI_MOSI UART_RTS I2C_SCL GPIO_16 116 SPI_SCLK UART_TXD G...

Страница 90: ...factory fuel depot or gas station It is dangerous to operate a mobile terminal next to any potentially explosive electrical equipment The mobile terminal receives or transmits radio frequency energy...

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