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CrossLink LIF-MD6000 Master Link Board

Evaluation Board User Guide

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. All other brand or product names are

trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-EB-02010-1.4

Acronyms in This Document

A list of acronyms used in this document.

Acronym

Definition

CMOS

Complementary Metal-Oxide Semiconductor

CSI-2

Camera Serial Interface

DSI

Display Serial Interface

FTDI

Future Technology Devices International

Inter-Integrated Circuit

Input/Output

LVDS

Low-Voltage Differential Signaling

MIPI

Mobile Industry Processor Interface

SPI

Serial Peripheral Interface

Содержание CrossLink LIF-MD6000

Страница 1: ...CrossLink LIF MD6000 Master Link Board Evaluation Board User Guide FPGA EB 02010 Version 1 4 April 2018...

Страница 2: ...erials 27 Appendix C SMA IOL EVN BRD Schematics 33 Appendix D SMA IOL EVN BRD Bill of Materials 34 Appendix E B IOL EVN BRD Schematics 35 Appendix F B IOL EVN BRD Bill of Materials 36 RevisionHistory...

Страница 3: ...tive holders The specifications and information herein are subject to change without notice FPGA EB 02010 1 4 3 Acronyms in This Document A list of acronyms used in this document Acronym Definition CM...

Страница 4: ...ons of on board jumper settings programming circuit a complete set of schematics and bill of materials for LIF MD6000 Master Link board Refer to Appendix A B C D E F for the schematics and BOM of the...

Страница 5: ...istered trademarks patents and disclaimers are as listed at www latticesemi com legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifica...

Страница 6: ...OFF SHORT ON J4 External clock input for MIPI D PHY reference clock J6 External or internal clock selection 1 2 External 2 3 Internal J18 External SP I2C access SW2 Configuration reset for LIF MD6000...

Страница 7: ...ks with Diamond programmer software to provide interfaces for JTAG to program MachXO2 1300E SPI to program both CrossLink and SPI Flash Memory USB Mini B J2 FTDI Chip U1 SPI Flash U14 LIF MD6000 CSFBG...

Страница 8: ...HY I F D PHY Rx LVDS CMOS D PHY Rx LVDS CMOS Tx Connector 2 Tx Connector 1 D PHY I F Figure 3 2 Bridging Block 3 2 I2 C Expander Figure 3 3 shows the block diagram of the I2 C expander The LCMXO3LF 12...

Страница 9: ...XO3LF 1300E as well as to the external boards connected to Tx and Rx Headers Each I O and core voltage rail on the board is accessible by a test point on the board The current flowing to each rail can...

Страница 10: ...n herein are subject to change without notice 10 FPGA EB 02010 1 4 Table 4 2 Device Power Rail Summary and Test Points Voltage Rail Source Rail Current Sense Resistor Test Points 12 V 12_Ext 12V 5 V 1...

Страница 11: ...their respective holders The specifications and information herein are subject to change without notice FPGA EB 02010 1 4 11 5 Status Indicators The LED status indicators on the board show power confi...

Страница 12: ...or DATA1_TX_P Pin 7 J6 SMA connector for DATA1_TX_N Pin 8 J7 SMA connector for DATA2_TX_P Pin 13 J8 SMA connector for DATA2_TX_N Pin 14 J9 SMA connector for DATA3_TX_P Pin 16 J10 SMA connector for DAT...

Страница 13: ...tents and disclaimers are as listed at www latticesemi com legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifications and information...

Страница 14: ...s signals to the 26 pin header J2 Table 7 1 Headers and Test Connectors Part Description Setting J2 13x2 Header U1 Connector to interface to CrossLink Master Link board Table 7 2 U1 Connector Descript...

Страница 15: ...change without notice FPGA EB 02010 1 4 15 Table 7 3 J2 Header Description Pin Name Mapping to U1 1 3 3V N A 2 1 8V N A 3 RESETN Pin 22 4 CH4_DCK_TX_P Pin 1 5 SDA Pin 39 6 CH4_DCK_TX_N Pin 2 7 SCL Pin...

Страница 16: ...and disclaimers are as listed at www latticesemi com legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifications and information here...

Страница 17: ...s of their respective holders The specifications and information herein are subject to change without notice FPGA EB 02010 1 4 17 8 Ordering Information Table 8 1 Ordering Information Description Orde...

Страница 18: ...legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifications and information herein are subject to change without notice 18 FPGA EB 02...

Страница 19: ...I2C LVDS RX In LVDS RX In SPI BANK 3 4 BANK 2 BANK 0 LCMXO3LF 1300 MG121 JTAG I2C 3 I O Expander I2C Switch Targeted FPGA SPI FLASH I2C SPI SPI I2C 2 I2C 1 SPI SPI I2C D D Da a at t te e e S S Siiiz...

Страница 20: ...B B 1 1 1 0 0 0 8 8 8 2 2 2 F F FT T TD D DI I I I I IN N NT T TE E ER R RF F FA A AC C CE E E L L LI I IF F FM M MD D D 6 6 60 0 00 0 00 0 0 6 6 6M M MG G G8 8 81 1 1I I I S S Sn n no o ow w w b b b...

Страница 21: ...c c ce e es s se e em m miii c c co o om m m B B Bo o oa a ar r rd d d R R Re e ev v v P P Pr r ro o ojjje e ec c ct t t 1 1 16 6 6 F F FE E EB B B 1 1 16 6 6 B B B 1 1 1 0 0 0 8 8 8 3 3 3 P P PO O OW...

Страница 22: ...t t t T T Tiiit t tllle e e L L La a at t tt t tiiic c ce e e S S Se e em m miiic c co o on n nd d du u uc c ct t to o or r r A A Ap p pp p pllliiic c ca a at t tiiio o on n ns s s E E Em m ma a aiiil...

Страница 23: ...o o of f f S S Sh h he e ee e et t t T T Tiiit t tllle e e L L La a at t tt t tiiic c ce e e S S Se e em m miiic c co o on n nd d du u uc c ct t to o or r r A A Ap p pp p pllliiic c ca a at t tiiio o...

Страница 24: ...Tiiit t tllle e e L L La a at t tt t tiiic c ce e e S S Se e em m miiic c co o on n nd d du u uc c ct t to o or r r A A Ap p pp p pllliiic c ca a at t tiiio o on n ns s s E E Em m ma a aiiilll t t te...

Страница 25: ...uF C104 0 1uF C151 0 1uF R404 4 7k R436 680R C105 0 1uF R440 4 7k C141 10uF D23 Red 1 2 R437 680R R405 4 7k SW3 SYS_RST C106 1uF R179 650 D30 blue 1 2 BANK2 LCMXO3LF 1200E MG121 U19C VCCIO2 H6 H7 H9 J...

Страница 26: ...y MIPI LVDS Simulation Requirement 1 MIPI Differential Mode insertion Loss shall be 1 6dB at 750 MHz 2 MIPI Differential Mode Return Loss shall be 15dB at 750 MHz 3 MIPI Common Mode Return Loss shall...

Страница 27: ...NC Samsung Cap Ceramic 0 1 F 10 V X5R 20 SMD 0402 85C Paper T R 7 C41 C43 C53 C60 C67 C71 6 1 F C0306 LLR185C70G1 05ME05L Murata CAP CER 1 F 4 V X7S 0306 8 C42 C44 2 0 01 F C0201 GRM033R61C 103KA12D M...

Страница 28: ...3 GRM188R71E 104KA01D Murata CAP CER 0 1 F 25 V 10 X7R 0603 27 C127 1 680 pF C0603 C0603C681J3 GACTU Kemet CAP CER 680 pF 25 V 5 NP0 0603 28 C128 1 0 47 F C0402 CL05A474KA5 NNNC Samsung CAP CER 0 47 F...

Страница 29: ...1 Molex CONN HEADER 8POS 100 VERT TIN 42 J2 1 SKT_MINI USB_B_R A skt_miniu sb_b_ra 5075BMR 05 SM CR Neltron CONN MINI USB RCPT RA TYPE B SMD 43 J3 1 PJ 032A PJ 032A PJ 032A CUI Inc CON PWR JCK 2 0 X 6...

Страница 30: ...47 23 0 R0603 RC0603JR 070RL Yageo Res 1 10 W 0 0 5 0603 58 R9 R10 2 2K2 R0603 CRCW06032 K20FKEA Vishay RES SMD 2 2 k 1 1 10 W 0603 59 R11 R17 2 12K R0603 RC0603FR 0712KL Yageo RES SMD 12 k 1 1 10 W 0...

Страница 31: ...R117 R119 R121 10 100 R0402 DNI RC0402FR 07100RL Yageo RES SMD 100 1 1 16 W 0402 74 R160 R432 2 100K R0402 RMCF0402JT 100K Stackpole Electronics Inc RES 100 k 1 16 W 5 0402 75 R166 R441 R442 R443 R444...

Страница 32: ...17ST 33T3G sot223_4p NCP1117ST33T3G On Semi IC Reg LDO 3 3 V SOT 223 92 U6 1 NCP1117ST 25T3G sot223_4p NCP1117ST25T3G On Semi IC Reg LDO 2 5 V SOT 223 93 U7 U9 U11 U12 4 Hirose FX12 40 Pos Hirose FX12...

Страница 33: ...or r r A A Ap p pp p pllliiic c ca a at t tiiio o on n ns s s E E Em m ma a aiiilll t t te e ec c ch h hs s su u up p pp p po o or r rt t t L L La a at t tt t tiiic c ce e es s se e em m miii c c co...

Страница 34: ...turer Description 1 GND1 5 V 1 8 V 3 3 V SN SDA SCLK SCL RESETN MOSI MISO GND 12 TP_S_ 40_63 tp_s_40_ 63 DNI Square test point 40 mil inner diameter 63 mil outer diameter 2 C1 C4 2 1 F C0402 C0402C105...

Страница 35: ...ate Size Schematic Rev of Sheet Title Lattice Semiconductor Applications Email techsupport Latticesemi com Board Rev Project 04 May 15 B 1 0 1 1 100MILS_DEBUG HEADER LCMXO3L 4300 MG256 MIPI Briding so...

Страница 36: ...Quantity Part PCB Footprint Comments Part_ Number Manufacturer Description 1 GND1 5 V 1 8 V 3 3 V SN SCLK MOSI MISO GND 9 TP_S_40_ 63 tp_s_40_63 DNL Square test point 40 mil inner diameter 63 mil out...

Страница 37: ...e Version Change Summary April 2018 1 4 Made schematics searchable March 2018 1 3 Added footnote to Table 2 1 September 2017 1 2 Changed document number from EB105 to FPGA EB 02010 Changed J25 from VC...

Страница 38: ...7th Floor 111 SW 5th Avenue Portland OR 97204 USA T 503 268 8000 www latticesemi com...

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