background image

 

CrossLink LIF-MD6000 Master Link Board 

 

Evaluation Board User Guide 

 

© 2016-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at 

www.latticesemi.com/legal

.  

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 

FPGA-EB-02010-1.4 

 

23 

 

CrossLink LIF-MD6000 Master Link Board 

 

Evaluation Board User Guide 

 

Bank 1, 2 – LVDS Rx 

5

5

4

4

3

3

2

2

1

1

D

D

C

C

B

B

A

A

NOTE : PLACE ALL THE TERMINATION
RESISTORS ON TOP SIDE AND CLOSE
TO THE U8

LVDS RX TERMINATION RESISTORS

R

X

 

C

o

n

n

e

c

t

o

r

1

R

X

 

C

o

n

n

e

c

t

o

r

2

Note : Speed of the bus, < 2.5ps skew for pairs and
across the bus, traces should be 100 Ohms
Trace match LVDSI* pins between P and N channels as
well as individual pairs.  Minimize routing and trace
match *CD* signals to bank 3 pins.

Note :
1) Match length within pair as well as other pairs with +/- 5% tolerence
2)Differential impedance should be 100 Ohms and 50 Ohms as a single ended signals

All the power rails should be capable of carrying 1A current

3)

1. 0.001uF and 1.5nF is added as the piggyback cap

100nF and 1.5nF is loaded near DUT and 0.001uF and 1.5nF is
made piggy back for the following reference designer
C51,C59

DNI

Piggyback Configuration info:

NOTE : PLACE SWITCH IN THE TOP SIDE

EXTERNAL RESET

Default short (J29.2,J29.3)

CSSPIN
MCLK

CH0_DCK_P
CH0_DCK_N

CH0_DATA0_P
CH0_DATA0_N

CH0_DATA2_P
CH0_DATA2_N

CH0_DATA1_P
CH0_DATA1_N

CH0_DATA3_P
CH0_DATA3_N

GPIO3
GPIO4

GPIO3
GPIO4

CSSPIN
MCLK

CH1_DCK_P
CH1_DCK_N

CH1_DATA0_P
CH1_DATA0_N

CH1_DATA2_P
CH1_DATA2_N

CH1_DATA1_P
CH1_DATA1_N

CH1_DATA3_P
CH1_DATA3_N

RESETN

CMOS_IO_7
CMOS_IO_8

CMOS_IO_1

CMOS_IO_1

CMOS_IO_2

CMOS_IO_3

CMOS_IO_4

CMOS_IO_7
CMOS_IO_8

CMOS_IO_2

CMOS_IO_1

CMOS_IO_3
CMOS_IO_4

CMOS_IO_5
CMOS_IO_6

CMOS_IO_1
CMOS_IO_2

GPIO3
GPIO4

CH0_DATA2_P

CH0_DATA2_N

CH0_DCK_N

CH0_DCK_P

CH0_DATA1_P

CH0_DATA1_N

CH0_DATA3_P

CH0_DATA3_N

CH0_DATA0_P

CH0_DATA0_N

CH0_DATA0_P
CH0_DATA0_N

CH0_DATA1_P
CH0_DATA1_N

CH0_DATA3_P
CH0_DATA3_N

CH1_DATA0_P
CH1_DATA0_N
CH1_DATA3_P
CH1_DATA3_N
CH1_DATA2_P
CH1_DATA2_N

CH1_DATA1_P

CH1_DATA1_N

CH1_DATA0_N

CH1_DATA0_P

CH1_DATA3_P

CH1_DATA3_N

CH1_DATA2_P

CH1_DATA2_N

CH1_DCK_P

CH1_DCK_N

CH0_DATA2_P
CH0_DATA2_N

CH1_DATA1_P
CH1_DATA1_N

CMOS_IO_3

CH0_DCK_P
CH0_DCK_N

CMOS_IO_2

EXT_RST

CH1_DCK_P
CH1_DCK_N

CMOS_IO_5
CMOS_IO_6

CMOS_IO_4

RESETN

EXT_RST

CMOS_IO_5
CMOS_IO_6
CMOS_IO_7
CMOS_IO_8

5V

+3.3V +1.8V

5V

+3.3V +1.8V

12V

12V

12V

12V

12V

5V

+3.3V

+1.8V

12V

5V

+3.3V

+1.8V

VCCIO1

VCCIO2

VCCIO2

VCCIO1

VCCIO2

VCCIO0

SDA2

7

SCL2

7

2,4,6

CSSPIN

2,4,6

MCLK

RESE

R

T

E

N

SETN

4

7

SCL4

7

SDA4

SDA1

7

SCL1

7

7

SCL3

7

SDA3

SISPI

2,4,6

SPISO

2,4,6

RPI1

4

RPI2

4

D

D

Da

a

attte

e

e:::

S

S

Siiizzze

e

e

S

S

Sccch

h

he

e

em

m

ma

a

atttiiiccc   R

R

Re

e

evvv

o

o

offf

S

S

Sh

h

he

e

ee

e

ettt

T

T

Tiiitttllle

e

e

L

L

La

a

attttttiiiccce

e

e   S

S

Se

e

em

m

miiiccco

o

on

n

nd

d

du

u

ucccttto

o

orrr   A

A

Ap

p

pp

p

pllliiiccca

a

atttiiio

o

on

n

nsss

E

E

Em

m

ma

a

aiiilll:::   ttte

e

eccch

h

hsssu

u

up

p

pp

p

po

o

orrrttt@

@

@L

L

La

a

attttttiiiccce

e

essse

e

em

m

miii...ccco

o

om

m

m

B

B

Bo

o

oa

a

arrrd

d

d   R

R

Re

e

evvv

P

P

Prrro

o

ojjje

e

ecccttt

1

1

16

6

6---F

F

FE

E

EB

B

B---1

1

16

6

6

B

B

B

1

1

1...0

0

0

8

8

8

5

5

5

B

B

BA

A

AN

N

NK

K

K1

1

1,,,2

2

2   ---   L

L

LV

V

VD

D

DS

S

S   R

R

RX

X

X

L

L

LIIIF

F

FM

M

MD

D

D---6

6

60

0

00

0

00

0

0---6

6

6M

M

MG

G

G8

8

81

1

1III   S

S

Sn

n

no

o

ow

w

w   b

b

brrriiid

d

dg

g

giiin

n

ng

g

g   ssso

o

olllu

u

utttiiio

o

on

n

n

B

B

B

D8

blue

1

2

R458

0

R55

680R

NI

SW4

EXT

_RST

R424

0

R446

0

C60

1uF
4V

D9

blue

1

2

J29
CON3

1

2

3

R445

4.7k

R461

0

R425

0

R110
100

DNI

C167

0.1uF

C163

0.1uF

C58

100nF
16V

R469

0

J28

CON6

1
2
3
4
5
6

U11

Hirose - FX12 - 40 Pos

CH1_DCK_P

1

CH1_DCK_N

2

GND

3

CH1_DATA0_P

4

CH1_DATA0_N

5

GND

6

CH1_DATA2_P

7

CH1_DATA2_N

8

GND

9

SN

10

SCLK

11

PWR_12_0V

12

SDA1

13

SCL1

14

GND

15

CH3_DATA0_P

16

CH3_DATA0_N

17

GND

18

CH3_DCK_P

19

CH3_DCK_N

20

PWR_12V

21

RESETN

22

PWR_5-0V

23

CH1_DATA1_P

24

CH1_DATA1_N

25

PWR_3-3V

26

CH1_DATA3_P

27

CH1_DATA3_N

28

PWR_1-8V

29

MOSI

30

MISO

31

PWR_1-8V

32

GND

33

GND

34

PWR_3-3V

35

CH3_DATA1_P

36

CH3_DATA1_N

37

PWR_5-0V

38

SDA

39

SCL

40

Shield1

41

Shield2

42

Shield3

43

Shield4

44

Shield5

45

Shield6

46

R472

0

R462

0

D6

blue

1

2

R113
100

DNI

R111
100

DNI

R470

0

D7

blue

1

2

R476

0

R114
100

DNI

R473

0

R60

0

C164

0.1uF

R117
100

DNI

R459

0

C168

0.1uF

R61

0

R119
100

DNI

C165

0.1uF

C169

0.1uF

R474

0

R467

0

R460

0

C52

6800pF
10V

C166

0.1uF

C170

0.1uF

LIFMD6000-csfBGA81

U8B

PB29A/PCLKT1_0

G7

PB29C/PCLKT1_1

PB29B/PCLKC1_0

J6

G6

PB29D/PCLKC1_1

H6

PB34A/GR_PCLK1_0

D1

PB34C/MIPI_CLKT1_0

PB34B

J5

D2

H5

PB34D/MIPI_CLKC1_0

PB38A

E1

PB38C

PB38B

J4

E2

PB38D

H4

PB43C

J3

PB43D

H3

VCCIO1

F3

VCCIO1

G4

R121
100

DNI

R106
100

DNI

R422

0

DNI

C53

1uF
4V

R450

0

DNI

U12

Hirose - FX12 - 40 Pos

CH0_DCK_P

1

CH0_DCK_N

2

GND

3

CH0_DATA0_P

4

CH0_DATA0_N

5

GND

6

CH0_DATA2_P

7

CH0_DATA2_N

8

GND

9

SN

10

SCLK

11

PWR_12V

12

SDA1

13

SCL1

14

GND

15

CH2_DATA0_P

16

CH2_DATA0_N

17

GND

18

CH2_DCK_P

19

CH2_DCK_N

20

PWR_12-0V

21

RESETN

22

PWR_5-0V

23

CH0_DATA1_P

24

CH0_DATA1_N

25

PWR_3-3V

26

CH0_DATA3_P

27

CH0_DATA3_N

28

PWR_1-8V

29

MOSI

30

MISO

31

PWR_1-8V

32

GND

33

GND

34

PWR_3-3V

35

CH2_DATA1_P

36

CH2_DATA1_N

37

PWR_5-0V

38

SDA

39

SCL

40

Shield1

41

Shield2

42

Shield3

43

Shield4

44

Shield5

45

Shield6

46

R468

0

R423

0

DNI

R463

0

R56

4.7k

C51

100nF
16V

R107
100

DNI

C181

0.1uF

R5

D

7

680R

DNI

C177

470pF
16V

R457

0

R471

0

R464

0

LIFMD6000-csfBGA81

U8C

PB2A

F9

PB2C/MIPI_CLKT2_0

PB2B

G9

F8

PB2D/MIPI_CLKC2_0

G8

PB6A/GR_PCLK2_0

E9

PB6C

PB6B

H9

E8

PB6D

H8

PB12A/GPLLT2_0

F7

PB12C

PB12B/GPLLC2_0

J9

E7

J8

PB12D

PB16A/PCLKT2_0

D9
D8

PB16B/PCLKC2_0

J7

PB16C/PCLKT2_1

H7

PB16D/PCLKC2_1

VCCIO2

E6

VCCIO2

F6

R59

680R

R54

680R

DNI

C59

1.5nF
10V

R475

0

R108
100

DNI

Содержание CrossLink LIF-MD6000

Страница 1: ...CrossLink LIF MD6000 Master Link Board Evaluation Board User Guide FPGA EB 02010 Version 1 4 April 2018...

Страница 2: ...erials 27 Appendix C SMA IOL EVN BRD Schematics 33 Appendix D SMA IOL EVN BRD Bill of Materials 34 Appendix E B IOL EVN BRD Schematics 35 Appendix F B IOL EVN BRD Bill of Materials 36 RevisionHistory...

Страница 3: ...tive holders The specifications and information herein are subject to change without notice FPGA EB 02010 1 4 3 Acronyms in This Document A list of acronyms used in this document Acronym Definition CM...

Страница 4: ...ons of on board jumper settings programming circuit a complete set of schematics and bill of materials for LIF MD6000 Master Link board Refer to Appendix A B C D E F for the schematics and BOM of the...

Страница 5: ...istered trademarks patents and disclaimers are as listed at www latticesemi com legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifica...

Страница 6: ...OFF SHORT ON J4 External clock input for MIPI D PHY reference clock J6 External or internal clock selection 1 2 External 2 3 Internal J18 External SP I2C access SW2 Configuration reset for LIF MD6000...

Страница 7: ...ks with Diamond programmer software to provide interfaces for JTAG to program MachXO2 1300E SPI to program both CrossLink and SPI Flash Memory USB Mini B J2 FTDI Chip U1 SPI Flash U14 LIF MD6000 CSFBG...

Страница 8: ...HY I F D PHY Rx LVDS CMOS D PHY Rx LVDS CMOS Tx Connector 2 Tx Connector 1 D PHY I F Figure 3 2 Bridging Block 3 2 I2 C Expander Figure 3 3 shows the block diagram of the I2 C expander The LCMXO3LF 12...

Страница 9: ...XO3LF 1300E as well as to the external boards connected to Tx and Rx Headers Each I O and core voltage rail on the board is accessible by a test point on the board The current flowing to each rail can...

Страница 10: ...n herein are subject to change without notice 10 FPGA EB 02010 1 4 Table 4 2 Device Power Rail Summary and Test Points Voltage Rail Source Rail Current Sense Resistor Test Points 12 V 12_Ext 12V 5 V 1...

Страница 11: ...their respective holders The specifications and information herein are subject to change without notice FPGA EB 02010 1 4 11 5 Status Indicators The LED status indicators on the board show power confi...

Страница 12: ...or DATA1_TX_P Pin 7 J6 SMA connector for DATA1_TX_N Pin 8 J7 SMA connector for DATA2_TX_P Pin 13 J8 SMA connector for DATA2_TX_N Pin 14 J9 SMA connector for DATA3_TX_P Pin 16 J10 SMA connector for DAT...

Страница 13: ...tents and disclaimers are as listed at www latticesemi com legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifications and information...

Страница 14: ...s signals to the 26 pin header J2 Table 7 1 Headers and Test Connectors Part Description Setting J2 13x2 Header U1 Connector to interface to CrossLink Master Link board Table 7 2 U1 Connector Descript...

Страница 15: ...change without notice FPGA EB 02010 1 4 15 Table 7 3 J2 Header Description Pin Name Mapping to U1 1 3 3V N A 2 1 8V N A 3 RESETN Pin 22 4 CH4_DCK_TX_P Pin 1 5 SDA Pin 39 6 CH4_DCK_TX_N Pin 2 7 SCL Pin...

Страница 16: ...and disclaimers are as listed at www latticesemi com legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifications and information here...

Страница 17: ...s of their respective holders The specifications and information herein are subject to change without notice FPGA EB 02010 1 4 17 8 Ordering Information Table 8 1 Ordering Information Description Orde...

Страница 18: ...legal All other brand or product names are trademarks or registered trademarks of their respective holders The specifications and information herein are subject to change without notice 18 FPGA EB 02...

Страница 19: ...I2C LVDS RX In LVDS RX In SPI BANK 3 4 BANK 2 BANK 0 LCMXO3LF 1300 MG121 JTAG I2C 3 I O Expander I2C Switch Targeted FPGA SPI FLASH I2C SPI SPI I2C 2 I2C 1 SPI SPI I2C D D Da a at t te e e S S Siiiz...

Страница 20: ...B B 1 1 1 0 0 0 8 8 8 2 2 2 F F FT T TD D DI I I I I IN N NT T TE E ER R RF F FA A AC C CE E E L L LI I IF F FM M MD D D 6 6 60 0 00 0 00 0 0 6 6 6M M MG G G8 8 81 1 1I I I S S Sn n no o ow w w b b b...

Страница 21: ...c c ce e es s se e em m miii c c co o om m m B B Bo o oa a ar r rd d d R R Re e ev v v P P Pr r ro o ojjje e ec c ct t t 1 1 16 6 6 F F FE E EB B B 1 1 16 6 6 B B B 1 1 1 0 0 0 8 8 8 3 3 3 P P PO O OW...

Страница 22: ...t t t T T Tiiit t tllle e e L L La a at t tt t tiiic c ce e e S S Se e em m miiic c co o on n nd d du u uc c ct t to o or r r A A Ap p pp p pllliiic c ca a at t tiiio o on n ns s s E E Em m ma a aiiil...

Страница 23: ...o o of f f S S Sh h he e ee e et t t T T Tiiit t tllle e e L L La a at t tt t tiiic c ce e e S S Se e em m miiic c co o on n nd d du u uc c ct t to o or r r A A Ap p pp p pllliiic c ca a at t tiiio o...

Страница 24: ...Tiiit t tllle e e L L La a at t tt t tiiic c ce e e S S Se e em m miiic c co o on n nd d du u uc c ct t to o or r r A A Ap p pp p pllliiic c ca a at t tiiio o on n ns s s E E Em m ma a aiiilll t t te...

Страница 25: ...uF C104 0 1uF C151 0 1uF R404 4 7k R436 680R C105 0 1uF R440 4 7k C141 10uF D23 Red 1 2 R437 680R R405 4 7k SW3 SYS_RST C106 1uF R179 650 D30 blue 1 2 BANK2 LCMXO3LF 1200E MG121 U19C VCCIO2 H6 H7 H9 J...

Страница 26: ...y MIPI LVDS Simulation Requirement 1 MIPI Differential Mode insertion Loss shall be 1 6dB at 750 MHz 2 MIPI Differential Mode Return Loss shall be 15dB at 750 MHz 3 MIPI Common Mode Return Loss shall...

Страница 27: ...NC Samsung Cap Ceramic 0 1 F 10 V X5R 20 SMD 0402 85C Paper T R 7 C41 C43 C53 C60 C67 C71 6 1 F C0306 LLR185C70G1 05ME05L Murata CAP CER 1 F 4 V X7S 0306 8 C42 C44 2 0 01 F C0201 GRM033R61C 103KA12D M...

Страница 28: ...3 GRM188R71E 104KA01D Murata CAP CER 0 1 F 25 V 10 X7R 0603 27 C127 1 680 pF C0603 C0603C681J3 GACTU Kemet CAP CER 680 pF 25 V 5 NP0 0603 28 C128 1 0 47 F C0402 CL05A474KA5 NNNC Samsung CAP CER 0 47 F...

Страница 29: ...1 Molex CONN HEADER 8POS 100 VERT TIN 42 J2 1 SKT_MINI USB_B_R A skt_miniu sb_b_ra 5075BMR 05 SM CR Neltron CONN MINI USB RCPT RA TYPE B SMD 43 J3 1 PJ 032A PJ 032A PJ 032A CUI Inc CON PWR JCK 2 0 X 6...

Страница 30: ...47 23 0 R0603 RC0603JR 070RL Yageo Res 1 10 W 0 0 5 0603 58 R9 R10 2 2K2 R0603 CRCW06032 K20FKEA Vishay RES SMD 2 2 k 1 1 10 W 0603 59 R11 R17 2 12K R0603 RC0603FR 0712KL Yageo RES SMD 12 k 1 1 10 W 0...

Страница 31: ...R117 R119 R121 10 100 R0402 DNI RC0402FR 07100RL Yageo RES SMD 100 1 1 16 W 0402 74 R160 R432 2 100K R0402 RMCF0402JT 100K Stackpole Electronics Inc RES 100 k 1 16 W 5 0402 75 R166 R441 R442 R443 R444...

Страница 32: ...17ST 33T3G sot223_4p NCP1117ST33T3G On Semi IC Reg LDO 3 3 V SOT 223 92 U6 1 NCP1117ST 25T3G sot223_4p NCP1117ST25T3G On Semi IC Reg LDO 2 5 V SOT 223 93 U7 U9 U11 U12 4 Hirose FX12 40 Pos Hirose FX12...

Страница 33: ...or r r A A Ap p pp p pllliiic c ca a at t tiiio o on n ns s s E E Em m ma a aiiilll t t te e ec c ch h hs s su u up p pp p po o or r rt t t L L La a at t tt t tiiic c ce e es s se e em m miii c c co...

Страница 34: ...turer Description 1 GND1 5 V 1 8 V 3 3 V SN SDA SCLK SCL RESETN MOSI MISO GND 12 TP_S_ 40_63 tp_s_40_ 63 DNI Square test point 40 mil inner diameter 63 mil outer diameter 2 C1 C4 2 1 F C0402 C0402C105...

Страница 35: ...ate Size Schematic Rev of Sheet Title Lattice Semiconductor Applications Email techsupport Latticesemi com Board Rev Project 04 May 15 B 1 0 1 1 100MILS_DEBUG HEADER LCMXO3L 4300 MG256 MIPI Briding so...

Страница 36: ...Quantity Part PCB Footprint Comments Part_ Number Manufacturer Description 1 GND1 5 V 1 8 V 3 3 V SN SCLK MOSI MISO GND 9 TP_S_40_ 63 tp_s_40_63 DNL Square test point 40 mil inner diameter 63 mil out...

Страница 37: ...e Version Change Summary April 2018 1 4 Made schematics searchable March 2018 1 3 Added footnote to Table 2 1 September 2017 1 2 Changed document number from EB105 to FPGA EB 02010 Changed J25 from VC...

Страница 38: ...7th Floor 111 SW 5th Avenue Portland OR 97204 USA T 503 268 8000 www latticesemi com...

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