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ID 34424, Rev. 3.0
Page 3 - 5
CP307
Installation
CUSTOMER SPECIFIC
P R E L I M I N A R Y
3.3
Standard Removal Procedures
To remove the board proceed as follows:
1. Ensure that the safety requirements indicated in Chapter 3.1 are observed. Particular at-
tention must be paid to the warning regarding the heat sink!
2. Ensure that no power is applied to the system before proceeding.
3. Disconnect any interfacing cables that may be connected to the board.
4. Unscrew the front panel retaining screws (two on the 4HP version and four on the 8HP).
5. Disengage the board from the backplane by first unlocking the board ejection handles
and then by pressing the handles as required until the board is disengaged.
6. After disengaging the board from the backplane, pull the board out of the slot.
7. Dispose of the board as required.
3.4
Hot Swap Procedures
The CP307 is not designed for hot swap operation. Do not attempt to hot swap this board. How-
ever, the CP307 supports the addition or removal of other boards whilst in a powered-up state.
3.5
Installation of CP307 Peripheral Devices
The CP307 is designed to accommodate a variety of peripheral devices whose installation var-
ies considerably. The following chapters provide information regarding installation aspects and
not detailed procedures.
3.5.1
CompactFlash Installation
The CompactFlash socket supports all available CompactFlash ATA cards type I and type II.
Warning!
Care must be taken when applying the procedures below to ensure that
neither the CP307 nor system boards are physically damaged by the
application of these procedures.
Warning!
Due care should be exercised when handling the board due to the fact that
the heat sink can get very hot. Do not touch the heat sink when changing
the board.
Note ...
The CP307 does not support removal and reinsertion of the CompactFlash
storage card while the board is in a powered-up state. Connecting the Com-
pactFlash cards while the power is on, which is known as "hot plugging", may
damage your system.
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