Intel® Server System R2000WF Product Family Technical Product Specification
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When only one DIMM is used for a given memory channel, it must be populated in the BLUE DIMM
slot (furthest from the CPU).
Mixing of DDR4 DIMM Types (RDIMM, LRDIMM, 3DS RDIMM, 3DS, LRDIMM) within a channel socket or
across sockets produces a Fatal Error Halt during Memory Initialization.
Mixing DIMMs of different frequencies and latencies is not supported within or across processor
sockets. If a mixed configuration is encountered, the BIOS will attempt to operate at the highest
common frequency and the lowest latency possible.
When populating a Quad-rank DIMM with a Single- or Dual-rank DIMM in the same channel, the
Quad-rank DIMM must be populated farthest from the processor. Intel MRC will check for correct
DIMM placement. A maximum of 8 logical ranks can be used on any one channel, as well as a
maximum of 10 physical ranks loaded on a channel.
The memory slots associated with a given processor are unavailable if the corresponding processor
socket is not populated.
A processor may be installed without populating the associated memory slots, provided a second
processor is installed with associated memory.
In this case, the memory is shared by the processors.
However, the platform suffers performance degradation and latency due to the remote memory.
Processor sockets are self-contained and autonomous. However, all memory subsystem support
(such as Memory RAS, Error Management,) in the BIOS setup are applied commonly across processor
sockets.
For multiple DIMMs per channel:
o
For RDIMM, LRDIMM, 3DS RDIMM, 3DS LRDIMM; Always populate DIMMs with higher electrical
loading in slot1, followed by slot 2.
o
NVM DIMMs must be populated in DIMM slot 1 of a given memory channel when paired with
an RDIMM or 3DS RDIMM type
4.2
Thermal Management Overview
In order to maintain the necessary airflow within the system, all of the previously listed components and top
cover need to be properly installed. For optimum system performance, the external ambient temperature
should remain below 35 °C and all system fans should be operational. System fan redundancy can be
supported for system configurations that meet the necessary fan redundancy support limits identified in
Appendix D.
For system configurations that support fan redundancy, should a single fan failure occur (system fan or
power supply fan), integrated platform management changes the state of the system status LED to blinking
green, reports an error to the system event log, and automatically adjusts fan speeds as needed to maintain
system temperatures below maximum thermal limits.
Note
: All system fans are controlled independently of each other. The fan control system may adjust fan
speeds for different fans based on increasing/decreasing temperatures in different thermal zones within the
chassis.
In the event that system temperatures should continue to increase with the system fans operating at their
maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem,
the processors, or both to keep components from overheating and keep the system operational. Throttling
of these sub-systems continues until system temperatures are reduced below preprogrammed limits.
