Intel® Server System R2000WF Product Family Technical Product Specification
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solution (heat sink with no fan attached). If the add-in card does not meet these criteria, the given knock-out
panel should not be removed.
When installing a double wide add-in card with a passive heat sink solution, remove only the plastic knock-
out from the side on which the add-in card is installed. Only remove both plastic knock outs when installing
two cards that meet the criteria defined above (one per riser card). Once a knock-out panel is removed, it
cannot be re-installed.
High power add-in cards with active cooling (heat sink with mounted fan), are only supported in system
configurations installed with the standard shipping air duct (default). High power add-in cards with active
cooling (heat sink with mounted fan) are not supported in systems configured with the high air flow air duct
included in accessory kit AWFCOPRODUCTAD.
A system configured with the contents of accessory kits AWFCOPRODUCTAD and AWFCOPRODUCTBKT and
an Intel® Xeon Phi™ card can also support the following additional PCIe* add-in card configurations.
PCIe add-in cards with minimum 100 LFM (0.5 m/s) or 200 LFM (1m/s) air flow requirement can be
installed in any available add-in card slot in Riser Card #1, Riser Card #2, and Riser Card #3 (if
installed)
PCIe add-in cards with a minimum 300 LFM (1.5 m/s) air flow requirement can be installed in the
bottom add-in card slot of Riser Card #1 and Riser Card #2.
PCIe add-in cards with air flow requirement greater than 300 LFM cannot be supported.
Systems configured with an Intel Xeon Phi card and/or non-Intel GPGPU card must have a shipping bracket
installed before the system is exposed to any level of shock or vibration or is transported to the end user
location. Failure to install the shipping bracket has the potential to cause serious damage to various
components within the system. The shipping bracket is only available as part of accessory kit
AWFCOPRODUCTBKT.
Figure 38. Shipping bracket
