Intel® Server System R2000WF Product Family Technical Product Specification
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The Intel® Server System R2000WF product family supports short-term, excursion-based, operation up to
45 °C (ASHRAE A4) with limited performance impact. The configuration requirements and limitations are
described in the configuration matrix found in Appendix D of this document or in the Intel® S2600WF
Product Family Power Budget and Thermal Configuration Tool available as a download online at:
The installation and functionality of several system components are used to maintain system thermals. They
include six managed 60 mm system fans, fans integrated into each installed power supply module, an air
duct, populated drive carriers, and installed CPU heats sinks. Drive carriers can be populated with a storage
device (SSD or HDD) or supplied drive blank. In addition, it may be necessary to have specific DIMM slots
populated with DIMMs or supplied DIMM blanks. System configurations that require population of specific
DIMM slots ship from Intel with DIMM blanks pre-installed. Pre-installed DIMM blanks should only be
removed when installing a memory module in its place. Chassis only products include DIMM blanks
separately in the accessory kit and must be installed in the appropriate DIMM slot locations as defined in the
following section.
4.1
Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet the
following operating and configuration guidelines:
The system is designed to sustain operations at an ambient temperature of up to 35 °C (ASHRAE
Class A2) with short term excursion based operation up to 45 °C (ASHRAE Class A4).
The system can operate up to 40 °C (ASHRAE Class A3) for up to 900 hours per year.
The system can operate up to 45 °C (ASHRAE Class A4) for up to 90 hours per year.
System performance may be impacted when operating within the extended operating temperature
range.
There is no long term system reliability impact when operating at the extended temperature range
within the documented limits.
Specific configuration requirements and limitations are documented in the configuration matrix found in
Appendix D of this document or in the Intel® Server Board S2600WF product family Power Budget and
Thermal Configuration Tool, available as a download online at
The CPU-1 processor and CPU heat sink must be installed first. The CPU-2 heat sink must be installed at all
times, with or without a processor installed.
Thermally, a system supporting fan redundancy can support the following PCI add-in cards when the system
is operating at up to a maximum operating ambient temperature of 35 °C (ASHRAE Class 2).
Airflow for add-in cards is measured at local inlet. Add-in card thermal support limits are listed by riser and
by riser slot in the following tables. This limitation is driven primarily by fan failure performance.
Table 45. PCIe* add-in card airflow (LFM) support limits – R2312WFxxx and R2224WFxxx
PCIe* Add-In Slot
Riser Slot #1
Riser Slot #2
Riser Slot #3
Top
100 LFM
200 LFM
100 LFM
Middle
100 LFM
200 LFM
100 LFM
Bottom
200 LFM
200 LFM
N/A
