Intel® Server System R2000WF Product Family Technical Product Specification
Intel Confidential
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Appendix D.
System Configuration Table for Thermal Compatibility
This section provides system configuration compatibility data based on various supported system operating thermal limits. Two tables are
provided. The first table identifies supported system configurations while the system is in “normal” operating mode meaning all systems fans are
present, on-line, and operational. The second table identifies supported system configurations while the system is in a “fan fail” mode meaning
one system fan or system fan rotor is no longer on-line or operational and fan redundancy is lost.
The following notes communicate support criteria associated with specific configurations identified in the following tables. Each relevant note to
a configuration is identified by a reference number in the table. Listed notes that are not specified in the table reflect support criteria for a similar
1U based system within the Intel® Server S2600WF product family, details of which can be found in the Intel® Server System R1000WF Technical
Product Specification.
Thermal configuration table notes
:
1. The 27°C configuration alone is limited to elevations of 900m or less. Altitudes higher than 900m need to be de-rated to ASHRAE Class 2
levels.
2. To support system fan redundancy, the system must be configured with two power supplies to maintain sufficient cooling. Concurrent system
and power supply fan failures is not supported.
3. Processor throttling may occur which may impact system performance. CPU reliability is not impacted.
4. In fan fail mode, Intel® OCP Module are only supported in the specified base system model configured.
5. Use of the designated PCIe* slot is limited to add-in cards that have air flow requirements of 100 LFM or less. See add-in card specs for air flow
requirements.
6. For ASHRAE Class 3 and Class 4 support, the following power supply margining is required to meet thermal specifications:
a) For dual power supply configurations, the power budget must fit within a single power supply rated load and be installed in a dual
configuration, or
b) For single power supply configurations, the power budget must be sized with 30% margin to single power supply rated load.
7. Intel® Xeon Phi™ or non-Intel GPGPU cards may have performance impact during ASHRAE Class 2 and Class 3 ambient air excursions.
8. PCIe* SSD AIC FF devices can only be supported in the bottom add-in card slot on Riser Slot #1 and Riser Slot #2.
9. The Intel® RAID Maintenance Free Backup Unit (AXXRMFBUx) can support a case temperature of up to 45°C with the system operating in
normal mode and up to 55°C with the system operating in a fan fail mode. The case temperature of Intel® Smart RAID Battery (AXXRSBBUx) can
support up to 45°C in both normal and fan fail mode. Excursions over these specs may result in a reliability impact.
10. The system must be configured with Intel® accessory kits AWFCOPRODUCTAD, AWFCOPRODUCTBKT and A2UL16RISER2 in order to support
Intel® Xeon Phi™ or Non-Intel GPGPU add-in cards with passive cooling solutions.
11. System cooling capability testing was carried out in environmental lab controlled conditions according to ASHRAE standard.
12. Performance depends on data center environmental temperature and relative humidity levels controls provided by end user.
13. It is the responsibility of the system integrator to both consider the thermal configuration matrix and power budget tool documents in order
to arrange end use configuration.
14. M.2 drives may see performance impact under heavy work load.
15. Light workload is assuming 70% write, 30% read, 100% Random, 100% access, 8kb transfer rate, IO "delay" of 8.
