Intel EP80579, Руководство пользователя

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Development Kit User’s Guide
October 2008 Order Number: 320067-002US
3
Contents—Intel
®
EP80579 Integrated Processor with Intel
®
QuickAssist Technology
Contents
1.0 Introduction ..............................................................................................................8
1.1 Document Organization........................................................................................8
1.2 Related Documents .............................................................................................8
1.3 Acronyms...........................................................................................................9
2.0 Product Specification ............................................................................................... 11
2.1 Overview ......................................................................................................... 11
2.1.1
Product Description and Board Architecture................................................ 11
2.1.2 Feature List ........................................................................................... 13
2.2 Package Components......................................................................................... 13
2.3 System I/O ...................................................................................................... 14
2.3.1 Intel
®
EP80579 Development Board I/O.................................................... 14
2.3.2 Super I/O (SIO) ..................................................................................... 14
2.3.3 PEX 8508 PCI Express* Switch................................................................. 14
2.3.4 Marvell* 88E1141 Quad Ethernet Transceiver............................................. 15
2.4 System Memory ................................................................................................ 15
2.4.1
Supported DIMM Slot Populations ............................................................. 16
2.5 Supported Operating Systems............................................................................. 16
2.6 Supported Pre-boot Firmware Features ................................................................ 16
2.7 Intel
®
EP80579 Development Board Overview....................................................... 17
2.8 Mezzanine Cards ............................................................................................... 18
2.9 Power Supply.................................................................................................... 19
2.10 Ordering Information ......................................................................................... 19
3.0 System Overview ..................................................................................................... 20
3.1 Power Distribution ............................................................................................. 20
3.2 Platform Clocking .............................................................................................. 21
3.3 Platform Reset .................................................................................................. 22
3.4 SMBus ............................................................................................................. 24
4.0 Technical Reference ................................................................................................ 25
4.1 Board Components Layout.................................................................................. 25
4.2 IA-32 Core Frequency Selection .......................................................................... 28
4.3 SMBus Address ................................................................................................. 29
4.4 System LEDs .................................................................................................... 30
4.5 Fixed I/O Map and Interrupts .............................................................................. 31
4.6 Jumper Block.................................................................................................... 31
4.7 Header Blocks................................................................................................... 35
4.8 Connector/Header Pinout Information .................................................................. 36
4.8.1
ITP-XDP Connector Pinout ....................................................................... 36
4.8.2 ATX12V Power Connector Pinout............................................................... 37
4.8.3 LEB CompactFlash* Connector Pinout........................................................ 38
4.8.4 HSS Mezzanine Connectors Pinout ............................................................ 38
4.8.5 CAN Header Pinout ................................................................................. 42
4.8.6 IEEE 1588-2008 Hardware-Assist Header Pinout......................................... 42
4.8.7 Front Panel Header................................................................................. 42
4.8.8 SMBus Header ....................................................................................... 43
4.8.9 SSP Header ........................................................................................... 43
4.8.10 SIO Tertiary (Third) UART Header............................................................. 44
4.8.11 JTAG Access Headers .............................................................................. 44
4.8.12 GPIO Header ......................................................................................... 45
4.9 Mechanical Considerations .................................................................................. 45
4.9.1 Form Factor........................................................................................... 45
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