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Transpector SPS Operating Manual
5.3.1.7 Copper MOCVD
lists some of the materials of interest and the masses for monitoring them
for the deposition of copper using Cu
I
(hfac)(tmvs). Oxygen and water vapor are
unwanted contaminants.
Table 5-6 Tungsten CVD materials of interest
Chemical
Type
Monitoring Mass
WF
6
reagent
279
H
2
reagent
2
SiH
4
reagent
30, 31, 32
Ar
reagent
40
N
2
reagent
28
(interference from SiH4)
HF
product
20 (at 35 eV)
O
2
contaminant
32
(interference from SiH4)
H
2
O
contaminant
18 (at 35 eV)
WOF
4
by-product
257
Table 5-7 Copper MOCVD materials of interest
Chemical
Types
Monitoring Mass
CuI(hfac)(tmvs)
reagent
201, 63
H
2
reagent
2
Ar
reagent
40
tmvs
product
100, 85
H(hfac)
product
139
O
2
contaminant
32
H
2
O
contaminant
18
(if Ar present, use 35 eV)