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Understanding the xSeries 370 server design
The xSeries 370 server incorporates new design features and components.
In the xSeries 370 server design, the system has an I/O board, an I/O integrated
function card (commonly referred to as an I/O function card), a midplane, a
processor controller board, at least one processor daughterboard, and at least one
memory board. This modular design improves serviceability and provides for a
compact design.
Note:
See Chapter 5, “Board and adapter components” on page 101 for exploded
views of the major assemblies in the server.
I/O board
The I/O board houses the connectors for the PCI adapters and primary server
boards, and houses other I/O devices that you can install to expand the capabilities
of your server.
The I/O board contains the connectors for the midplane, I/O function card,
Advanced System Management PCI adapter, two USB ports, the PCI switch card,
twelve hot-plug PCI adapters, and two voltage regulator modules (VRMs).
Note:
The I/O board is also known as the I/O planar.
See “I/O board component locations” on page 102 for a layout of the I/O board.
Several features, such as the Wake on LAN feature, are built into the server I/O
board. To enable the Wake on LAN feature, you must install the appropriate
software and hardware in your server. For complete details, refer to the
documentation that comes with your Ethernet adapter.
I/O function card
The I/O function card houses the battery, I/O ports, and other I/O devices that you
can install to expand the capabilities of your server.
The I/O function card contains the connectors for the I/O board, Advanced System
Management PCI adapter, CD-ROM drive, diskette drive, front panel, keyboard,
mouse, SCSI and other I/O ports, jumpers, battery, and other devices.
See “I/O function card component locations” on page 103 for a layout of the I/O
function card.
Midplane
The midplane provides all of the interconnects for all of the major server
components.
The midplane contains the connectors for the I/O board, the processor controller
board, the standard memory board (A), the optional memory board (B), three
memory I/O cooling fans, three power supplies, a media power device (through
cabling), and a power control card.
See “I/O board component locations” on page 102, “Memory board component
locations” on page 105, and “Processor-controller board component locations” on
Chapter 4. Installing options
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