Chapter 3 - Hardware
0818D User’s Guide
3-1
3 Hardware
This chapter discusses the removal and installation of the SBC
module, add-in board modules, rear I/O modules, CMC board,
backplane, fan tray, blowers, and air filter.
CAUTION!
CAUTION!
CAUTION!
CAUTION! PLEASE NOTE
Unless working on hot-swap components, always shut
down the system and turn OFF all power and disconnect
the power cord before working on the system
Connector pins on CompactPCI
backplanes are
extremely delicate and can be easily bent. Precise
alignment and proper insertion/ejection procedures are
critical in order to avoid bending backplane pins.
Electrostatic Discharge (ESD) may damage memory chips,
programmed devices, and other electrical components.
ESD can be prevented by wearing a wrist strap attached to
a ground post on a static mat. Handling of this product
should ONLY be done by a properly trained technician in
an approved ESD work area.
Any unoccupied slots, both front and rear, must be
covered by a filler plate in order for proper cooling airflow
to take place. Leaving a slot uncovered could result in
overheating and failure of one or more system
components.
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