HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Electrical and Reliability Features
Issue 01 (2016-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
52
Item
Test Condition
Standard Sample
size
Results
Low-temperature
operating
Temperature:
–40ºC
Operation mode: working
with service connected
Test duration: 24 h
IEC6006
8-2-1
3 pcs/group Visual inspection: ok
Function test: ok
RF specification: ok
High-temperature
operating
Temperature: 85ºC
Operation mode: working
with service connected
Test duration: 24 h
JESD22-
A108-C
3 pcs/group Visual inspection: ok
Function test: ok
RF specification: ok
Temperature
cycle operating
High temperature: 85ºC
Low temperature: -40ºC
Operation mode: working
with service connected
Test duration: 30 cycles;1
h+1h /cycle
JESD22-
A105-B
3 pcs/group Visual inspection: ok
Function test: ok
RF specification: ok
Damp
heat
cycling
High temperature: 55ºC
Low temperature: 25ºC
Humidity: 95%±3%
Operation mode: working
with service connected
Test duration: 6 cycles;
12 h+12 h/cycle
JESD22-
A101-B
3 pcs/group Visual inspection: ok
Function test: ok
RF specification: ok
Thermal shock
Low temperature:
–40º
High temperature: 85ºC
Temperature
change
interval: < 30s
Operation
mode:
no
power
Test duration: 100 cycles;
15 min+15 min/cycle
JESD22-
A106-B
3 pcs/group Visual inspection: ok
Function test: ok
RF specification: ok
Salty fog test
Temperature: 35°C
Density
of
the
NaCl
solution: 5%±1%
Operation
mode:
no
power, no package
Test duration:
Spraying interval: 8 h
Exposing
period
after
removing the salty fog
environment: 16 h
JESD22-
A107-B
3 pcs/group Visual inspection: ok
Function test: ok
RF specification: ok