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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide

Mechanical Specifications

Issue 01 (2016-04-08)

Huawei Proprietary and Confidential

Copyright © Huawei Technologies Co., Ltd.

66

6.9.4 Welding Area Treatment

Step 1

Remove the old solder by using a soldering iron and solder braid that can wet the

solder.

Step 2

Clean the pad and remove the flux residuals.

Step 3

Solder pre-filling: Before the module is installed on a board, apply some solder paste

to the pad of the module by using the rework fixture and stencil or apply some solder
paste to the pad on the PCB by using a rework stencil.

It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the
rework.

6.9.5 Module Installation

Install the module precisely on the module and ensure the right installation direction of
the module and the reliability of the electrical connection with the PCB. It is
recommended that the module be preheated in order to ensure that the temperature
of all parts to be soldered is uniform during the reflow process. The solder quickly
reflows upon heating so the parts are soldered reliably. The solder joints undergo
proper reflow duration at a preset temperature to form a favorable Intermetallic
Compound (IMC).



It is recommended that a special clamp be used to pick the module when the module is
installed on the pad after applied with some solder.



A special rework device must be used for the rework.

6.9.6 Specifications of Rework

Temperature parameter of rework: for either the removing or welding of the module,
the heating rate during the rework must be equal to or smaller than 3°C/s, and the
peak temperature between 240°C

–250°C. The following parameters are

recommended during the rework.

Figure 6-11

Temperature graph of rework

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Содержание MU509-65

Страница 1: ...HUAWEI MU509 65 HSDPA LGA Module Hardware Guide Issue 01 Date 2016 04 08 ...

Страница 2: ...cations contained in this manual without prior notice and without any liability DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED AS IS EXCEPT AS REQUIRED BY APPLICABLE LAWS NO WARRANTIES OF ANY KIND EITHER EXPRESS OR IMPLIED INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE MADE IN RELATION TO THE ACCURACY RELIABILITY OR CONTENTS OF ...

Страница 3: ...rdware Guide About This Document Issue 01 2016 04 08 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 3 About This Document Revision History Document Version Date Chapter Descriptions 01 2016 04 08 Initial release ...

Страница 4: ... Power Interface 22 3 3 1 Overview 22 3 3 2 Input Power Supply Interface 23 3 3 3 Output Power Supply Interface 24 3 4 Signal Control Interface 25 3 4 1 Overview 25 3 4 2 POWER_ON_OFF Pin 26 3 4 3 RESIN_N Pin 28 3 4 4 LED Pin 29 3 4 5 WAKEUP_IN Pin 32 3 4 6 WAKEUP_OUT Pin 33 3 5 UART Interface 34 3 5 1 Overview 34 3 6 USB Interface 36 3 7 USIM Card Interface 37 3 7 1 Overview 37 3 8 Audio Interfac...

Страница 5: ... 5 Electrical and Reliability Features 48 5 1 About This Chapter 48 5 2 Absolute Ratings 48 5 3 Operating and Storage Temperatures 49 5 4 Power Supply Features 49 5 4 1 Input Power Supply 49 5 4 2 Power Consumption 50 5 5 Reliability Features 51 5 6 EMC and ESD Features 53 6 Mechanical Specifications 56 6 1 About This Chapter 56 6 2 Storage Requirement 56 6 3 Moisture Sensitivity 56 6 4 Dimensions...

Страница 6: ...tifications 67 8 Safety Information 68 8 1 About This Chapter 68 8 2 Interference 68 8 3 Medical Device 68 8 4 Area with Inflammables and Explosives 69 8 5 Traffic Security 69 8 6 Airline Security 69 8 7 Safety of Children 69 8 8 Environment Protection 70 8 9 WEEE Approval 70 8 10 RoHS Approval 70 8 11 Laws and Regulations Observance 70 8 12 Care and Maintenance 70 8 13 Emergency Call 71 8 14 Regu...

Страница 7: ...troduction This document describes the hardware application interfaces and air interfaces that are provided when the HUAWEI MU509 65 HSDPA LGA module hereinafter referred to as the MU509 65 module is used This document helps hardware engineers to understand the interface specifications electrical features and related product information of the MU509 65 module ...

Страница 8: ...s L W H 30 mm 30 mm 2 6 mm Weight about 5 5 g Operating Bands WCDMA 1900 850 MHz Operating Temperature Normal working temperature 30 C to 75 C Extended working temperature 1 40 C to 85 C Storage Temperature 40 C to 85 C Humidity RH5 to RH95 Power Voltage DC 3 3 V to 4 2 V 3 8 V is recommended AT Commands See the HUAWEI MU509 65 HSDPA LGA Module AT Command Interface Specification Application Interf...

Страница 9: ...t message sending Management of text messages read messages delete messages storage status and message list Support for the Protocol Data Unit PDU mode Data Services WCDMA CS UL 64 kbit s DL 64 kbit s WCDMA PS UL 384 kbit s DL 384 kbit s HSDPA DL 3 6 Mbit s 1 When the MU509 65 module works in the range of 40 C to 30 C or 75 C to 85 C NOT all its RF performances comply with 3GPP specifications 2 3 ...

Страница 10: ...509 65 HSDPA LGA Module Hardware Guide Overall Description Issue 01 2016 04 08 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 10 Figure 2 1 Circuit block diagram of the MU509 65 module ...

Страница 11: ...pplication Interfaces 3 1 About This Chapter LGA Interface Power Interface Signal Control Interface UART Interface USB Interface USIM Card Interface Audio Interface General Purpose I O Interface JTAG Interface RF Antenna Interface Reserved Pins NC Pins 3 2 LGA Interface The MU509 65 module uses a 145 pin LGA as its external interface For details about the module and dimensions of the LGA see 6 4 D...

Страница 12: ...9 50 51 52 53 54 55 56 57 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 58 88 1 2 3 4 5 6 7 8 9 10 11 12 13 59 60 61 62 63 64 65 66 67 68 69 70 71 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 121 122 123 124 125 136 137 138 139 126 135 144 145 140 127 134 143 142 141 128 133 132 131 130 129 NC...

Страница 13: ...me Pad Type Description Parameter Min V Typ V Max V Comments 1 NC Not connected 2 NC Not connected 3 NC Not connected 4 NC Not connected 5 PCM_SYNC O PCM interface sync VOH 2 15 2 6 VOL 0 0 45 6 PCM_DIN I PCM I F data in VIH 1 69 2 9 VIL 0 3 0 91 7 PCM_DOUT O PCM I F data out VOH 2 15 2 6 VOL 0 0 45 8 PCM_CLK O PCM interface clock VOH 2 15 2 6 VOL 0 0 45 9 NC Not connected 10 NC Not connected 11 W...

Страница 14: ... point for it VIH 1 17 2 1 VIL 0 3 0 63 15 Reserved Reserved please keep this pin open 16 NC Not connected 17 NC Not connected 18 NC Not connected 19 NC Not connected 20 NC Not connected 21 NC Not connected 22 NC Not connected 23 NC Not connected 24 NC Not connected 25 NC Not connected 26 NC Not connected 27 NC Not connected 28 Reserved Reserved please keep this pin open 29 Reserved Reserved pleas...

Страница 15: ...17 2 1 VIL 0 3 0 63 37 NC Not connected 38 MIC2_P I Positive pole of the input of audio interface 2 39 MIC2_N I Negative pole of the input of audio interface 2 40 MIC1_P I Positive pole of the input of audio interface 1 41 MIC1_N I Negative pole of the input of audio interface 1 42 JTAG_TCK I JTAG clock input VIH 1 17 2 1 VIL 0 3 0 63 43 Reserved Reserved please keep this pin open 44 GPIO I O Gene...

Страница 16: ...not design pad 1 50 GND Ground 51 GPIO I O General Purpose I O pin VOH 2 15 2 6 2 6 The function of these pins has not been defined VOL 0 0 45 VIH 1 69 2 6 2 9 VIL 0 3 0 91 52 GND Ground 53 NOT USED Do not design pad 1 54 GND Ground 55 GPIO I O General Purpose I O pin VOH 2 15 2 6 2 6 The function of these pins has not been defined VOL 0 0 45 VIH 1 69 2 6 2 9 VIL 0 3 0 91 56 GND Ground 57 NOT USED...

Страница 17: ...VOH 1 35 1 8 VOL 0 0 45 73 UART_DSR O UART data set ready VOH 2 15 2 6 VOL 0 0 45 74 UART_RTS O UART ready for receive VOH 2 15 2 6 VOL 0 0 45 75 UART_DCD O UART data carrier detect VOH 2 15 2 6 VOL 0 0 45 76 UART_TX O UART transmit output VOH 2 15 2 6 VOL 0 0 45 77 UART_RING O UART ring indicator VOH 2 15 2 6 VOL 0 0 45 78 UART_RX I UART receive data input VIH 1 69 2 9 VIL 0 3 0 91 79 UART_DTR I ...

Страница 18: ... 1 8 2 85 1 95 3 0 USIM_VCC 1 8 V 2 85 V VOL 0 0 36 0 57 89 USIM_DATA I O External USIM data signal VOH 1 65 2 7 1 8 2 85 1 95 3 0 USIM_VCC 1 8 V 2 85 V VOL 0 0 36 0 57 VIH 1 65 2 7 1 8 2 85 1 95 3 0 VIL 0 0 36 0 57 90 USIM_CLK O External USIM clock signal VOH 1 65 2 7 1 8 2 85 1 95 3 0 USIM_VCC 1 8 V 2 85 V VOL 0 0 36 0 57 91 LED_STATUS I Network status LED Current drive 92 NC Not connected 93 JT...

Страница 19: ...IH 1 17 2 1 VIL 0 3 0 63 101 LED_MODE I Network mode LED Current sink Driver strength 10 mA Current drive 102 NC Not connected 103 NC Not connected 104 NC Not connected 105 GPIO I O General Purpose I O pin VOH 2 15 2 6 2 6 The function of these pins has not been defined VOL 0 0 45 VIH 1 69 2 6 2 9 VIL 0 3 0 91 106 GND Ground 107 MAIN_ANT RF main antenna pad 108 GND Ground 109 GPIO I O General Purp...

Страница 20: ...ned VIH 1 69 2 6 2 9 VIL 0 3 0 91 114 GND Ground 115 NC Not connected 116 GND Ground 117 NC Not connected 118 NC Not connected 119 NC Not connected 120 NC Not connected 121 GND Thermal Ground Pad 122 GND Thermal Ground Pad 123 GND Thermal Ground Pad 124 GND Thermal Ground Pad 125 GND Thermal Ground Pad 126 GND Thermal Ground Pad 127 GND Thermal Ground Pad 128 GND Thermal Ground Pad 129 GND Thermal...

Страница 21: ...ule in old devices directly without changing the pads of the old ones It is recommended that the new devices would be designed based on the new pads For details see Antenna Interface Compatibility Design in HUAWEI 30 mm x 30 mm LGA Module Hardware Migration Guide I indicates pins for digital signal input O indicates pins for digital signal output PI indicates power input pins PO indicates power ou...

Страница 22: ...t USIM_VCC pin for USIM card power output Table 3 2 lists the definitions of the pins on the power supply interface Table 3 2 Definitions of the pins on the power supply interface Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 12 and 13 VBAT PI Power supply input 3 3 3 8 4 2 48 50 52 54 56 58 59 106 108 110 112 114 and 116 GND GND 35 VCOIN PI Coin cell input 1 5 3 0 3 25...

Страница 23: ...p you are recommended to try to shorten the power supply circuit of the VBAT interface It is recommended that add the EMI ferrite bead FBMJ1608HS280NT manufactured by TAIYO YUDEN or MPZ1608S300ATAH0 manufactured by TDK is recommended to directly isolate DTE from DCE in the power circuit In addition the ESD diode BAT60B E6327 manufactured by INFINEON is recommended should be added Figure 3 3 shows ...

Страница 24: ...tery is not present If this interrupt occurs the RTC might be corrupted A different interrupt is generated if the crystal oscillator stops this signifies that handset timing is no longer accurate Again the RTC is corrupted When the VBAT power supply of the MU509 65 is normal the coin cell is charged from VBAT The MU509 65 reads the coin cell voltage and monitors the charging During normal operatio...

Страница 25: ... power supply is in the disabled state 3 4 Signal Control Interface 3 4 1 Overview The signal control part of the interface in the module consists of the following Power on off POWER_ON_OFF pin Hardware reset RESIN_N pin Network status LED LED_STATUS and LED_MODE pin WAKEUP_IN signal WAKEUP_IN pin WAKEUP_OUT signal WAKEUP_OUT pin Table 3 5 lists the pins on the signal control interface Table 3 5 P...

Страница 26: ... resistance of 0 Ω in the DTE to isolate signals transmitted from above pins in Table 3 5 3 4 2 POWER_ON_OFF Pin The module can be powered on off by the POWER_ON_OFF pin If the POWER_ON_OFF pin is pulled down for at least 0 5s the module is powered on if the POWER_ON_OFF pin is pulled down for at least 0 5s again the module is powered off Figure 3 5 Connections of the POWER_ON_OFF pin Power On Tim...

Страница 27: ...meter Comments Time Nominal values Unit TPON POWER_ON_OFF turn on time 0 5 TPON 1 s TPD POWER_ON_OFF Valid to USB D high 4 s If the DTE needs to detect the PID VID of module during the BIOS phase the detection time should exceed the TPD time Power Off Time Sequence Figure 3 7 Power off timing Table 3 7 Parameters description Parameter Comments Time Nominal values Unit TPOFF POWER_ON_OFF turn off t...

Страница 28: ...uit length not exceed 20 mm and that the circuit be kept at a distance of 2 54 mm 100 mil at least from the PCB edge Furthermore you need to wrap the area adjacent to the signal wire with a ground wire Otherwise the module may be reset due to interference The MU509 65 module supports hardware reset function If the software of the MU509 65 module stops responding you can reset the hardware through ...

Страница 29: ...ue of 3 8 V Different blinking modes of the status LED indicate different network status Table 3 8 describes the status of the LED_STATUS pin and LED_MODE pin Table 3 8 The status of the LED_STATUS pin and LED_MODE pin No Operating Status LED_STATUS LED_MODE 1 The 3G network is successfully registered The indicator blinks once each time Light off 2 The dial up connection is set up for accessing 3G...

Страница 30: ...echnologies Co Ltd 30 Blinking Fast Figure 3 11 Status when the indictor blinks fast Blinking Twice Each Time Figure 3 12 Status when the indictor blinks twice each time External Circuits Figure 3 13 shows the recommended circuits of the LED_MODE and LED_STATUS pins According to LED feature you can adjust the LED brightness by adjusting the impedance of resistor R ...

Страница 31: ...e the value such that it satisfies the following equation IF R VF VBAT VF Forward voltage IF Forward current Take an LED as an example Figure 3 14 shows its IF VF curves If VBAT is 3 8 V and the desired current through the LED IF is 3 mA then the voltage of the LED VF is 1 5 V according to IF VF curves and the corresponding value for resistance of R is 3 8 1 5 0 003 767 Ω The brightness of the LED...

Страница 32: ...p status in following two cases Before MU509 65 module is powered on if the WAKEUP_IN pin carries a low level voltage MU509 65 module is allowed to enter forced sleep status after MU509 65 module is powered on After MU509 65 module is powered on if WAKEUP_IN pin s level status changes from high to low that is the pin level is in falling edge MU509 65 module is allowed to enter forced sleep status ...

Страница 33: ...sleep status Forced sleep sta Normal status 3 4 6 WAKEUP_OUT Pin The WAKEUP_OUT pin is used to wake up the external system WAKEUP_OUT pin is low by default When a phone call or an SMS is coming the MU509 65 module will output a high pulse which lasts for 1s Within the duration of the high pulse if a new phone call or an SMS is coming the MU509 65 module will output the high pulse over again Figure...

Страница 34: ...interface supports signal control through standard modem handshake AT commands are entered and serial communication is performed through the UART interface The UART has the following features Full duplex 7 bit or 8 bit data 1 bit or 2 bit stop bit Odd parity check even parity check or non check Baud rate clock generated by the system clock Direct memory access DMA transmission Baud rate ranging fr...

Страница 35: ... 45 79 UART_DTR I UART data terminal ready VIH 1 69 2 9 VIL 0 3 0 91 80 UART_CTS I UART clear to send VIH 1 69 2 9 VIL 0 3 0 91 75 UART_DCD O UART data carrier detect VOH 2 15 2 6 VOL 0 0 45 73 UART_DSR O UART data set ready VOH 2 15 2 6 VOL 0 0 45 Figure 3 18 shows the connection of the UART interface in the MU509 65 module DCE with the host DTE Figure 3 18 Connection of the UART interface in the...

Страница 36: ...f RS 232 Transceivers must match that of the MU509 65 module Regardless of the connection modes when there is no data transmitted on the UART the host should set the RX pin of the module s UART to low level so that the module can enter sleep mode Otherwise UART always votes to stop the module from entering sleep mode 3 6 USB Interface The MU509 65 is compliant with USB 2 0 full speed protocol Figu...

Страница 37: ...ovides a USIM card interface complying with the ISO 7816 3 standard and supports automatic detection of a Class B USIM card or a Class C USIM card Table 3 11 lists the USIM card interface signals Table 3 11 USIM card interface signals Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 89 USIM_ DATA I O External USIM data signal VOH 1 65 2 7 1 8 2 85 1 95 3 0 USIM_VCC 1 8 V 2...

Страница 38: ...f the USIM card socket and the GND pin of the USIM card must be well connected to the power GND pin supplying power to the MU509 65 module A 2 2 μF capacitor and a 33 pF capacitor are placed between the USIM_VCC and GND pins in a parallel manner Three 33 pF capacitors are placed between the USIM_DATA and GND pins the USIM_RESET and GND pins and the USIM_CLK and GND pins in parallel to filter inter...

Страница 39: ...ntial pairs and the audio input signals in differential pairs should be separated effectively through ground In addition the audio signals should be located away from the circuits of the power supply RF and antenna The first audio channel can be used for the handset without requiring any audio amplifier The output power for the differential ear is typically 50 mW The second audio channel can be us...

Страница 40: ...e to prevent electrostatic discharge and protect integrated circuit IC components 3 8 2 Digital Audio The MU509 65 provides one digital audio channels Table 3 12 lists the signals on the digital audio interface Table 3 12 Signals on the digital audio interface Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V 5 PCM_SYNC O PCM interface sync VOH 2 15 2 6 VOL 0 0 45 6 PCM_DIN I PCM I ...

Страница 41: ...ontrolling signals which are worked at 2 6 V CMOS logic levels Customers can use AT command to control the state of logic levels of eight channels GPIO output signal see the HUAWEI MU509 65 HSDPA LGA Module AT Command Interface Specification Table 3 13 Signals on the GPIO interface Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 44 45 46 51 55 105 109 and 113 GPIO I O Gen...

Страница 42: ..._TCK I JTAG clock input VIH 1 17 2 1 VIL 0 3 0 63 72 JTAG_TDO O JTAG test data output VOH 1 35 1 8 VOL 0 0 45 87 JTAG_TDI I JTAG test data input VIH 1 17 2 1 VIL 0 3 0 63 93 JTAG_RTCK I JTAG return clock VIH 1 17 2 1 VIL 0 3 0 63 14 PS_HOLD I Used for JTAG interface assigning a test point for it VIH 1 17 2 1 VIL 0 3 0 63 100 RESIN_N I Reset module VIH 1 17 2 1 VIL 0 3 0 63 3 11 RF Antenna Interfac...

Страница 43: ...ot be used by the customer All of them should be Not Connected Table 3 16 Reserved pins Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V 15 28 29 and 43 Reserved Reserved please keep this pin open 3 13 NC Pins The module has some NC pins There are no signal connected to these pins Table 3 17 NC pins Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V 1 4 9 10 16 27 33 ...

Страница 44: ...Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements 4 2 Operating Frequencies Table 4 1 shows the RF bands supported by MU509 65 Table 4 1 RF bands Operating Band Tx Rx UMTS Band 2 1850 MHz 1910 MHz 1930 MHz 1990 MHz UMTS Band 5 824 MHz 849 MHz 869 MHz 894 MHz 4 3 Conducted RF Measurement 4 3 1 Test Environment Test instrument R S CMU200 Power supply KEITHLEY 2306 RF cabl...

Страница 45: ...nsitivity and Tx Power 4 4 1 Conducted Receive Sensitivity The conducted receive sensitivity is a key parameter that indicates the receiver performance of MU509 65 Table 4 2 MU509 65 conducted Rx sensitivity Band Typical Value Unit dBm Note WCDMA Band 2 111 BER 0 1 WCDMA Band 5 110 5 BER 0 1 The test values are the average of some test samples 4 4 2 Conducted Transmit Power The conducted transmit ...

Страница 46: ...ference impedance 50 Ω S11 shows the resonance feature and impedance bandwidth of an antenna Voltage standing wave ratio VSWR is another expression of S11 S11 relates to the antenna efficiency S11 can be measured with a vector analyzer The following S11 values are recommended for the antenna of MU509 65 S11 of the primary antenna 6 dB In addition S11 is less important than the efficiency and S11 h...

Страница 47: ...lly the TIS of the module To guarantee high performance of the module the interference sources on the user board must be properly controlled On the user board there are various interference sources such as the LCD CPU audio circuits and power supply All the interference sources emit interference signals that affect the normal operation of the module For example the module sensitivity can be decrea...

Страница 48: ...Operating and Storage Temperatures Power Supply Features Reliability Features EMC and ESD Features 5 2 Absolute Ratings Table 5 1 lists the absolute ratings for the module Using the module beyond these conditions may result in permanent damage to the module Table 5 1 Extreme working conditions for the MU509 65 module Symbol Specification Min Max Unit VBAT External power voltage 0 4 5 0 V VCOIN Inp...

Страница 49: ...e 30 75 C Extended operating temperature 1 40 85 C Ambient storage temperature 40 85 C 1 When the MU509 65 module works in the range of 40 C to 30 C or 75 C to 85 C NOT all its RF performances comply with 3GPP specifications 5 4 Power Supply Features 5 4 1 Input Power Supply Table 5 3 lists the requirements for input power of the MU509 65 module Table 5 3 Requirements for input power of the MU509 ...

Страница 50: ...9 65 module is normal voltage 3 8 V and all of test values are measured at room temperature Table 5 5 Averaged power off DC power consumption of MU509 65 module Description Typical Value Unit µA Notes Configuration The module is turned off 15 Normal voltage 3 8 V is ON and Power_On_Off pin is pulled low Table 5 6 Averaged standby DC power consumption of MU509 65 module HSDPA WCDMA Description Band...

Страница 51: ...Power 570 22 5 dBm Tx Power Test condition For max Tx power see 4 5 2 Conducted Transmit Power which are listed in Table 4 3 for max data throughput see 2 2 Function Overview which are listed in Table 2 1 5 5 Reliability Features Table 5 8 lists the test conditions and results of the reliability of the MU509 65 module Table 5 8 Test conditions and results of the reliability of the MU509 65 module ...

Страница 52: ...with service connected Test duration 30 cycles 1 h 1h cycle JESD22 A105 B 3 pcs group Visual inspection ok Function test ok RF specification ok Damp heat cycling High temperature 55º C Low temperature 25º C Humidity 95 3 Operation mode working with service connected Test duration 6 cycles 12 h 12 h cycle JESD22 A101 B 3 pcs group Visual inspection ok Function test ok RF specification ok Thermal sh...

Страница 53: ...n 30 Grms Shock duration 11 ms Operation mode working with service connected Test duration 6 axial directions 3 shocks for each axial direction JESD B1 04 C 3 pcs group Visual inspection ok Function test ok RF specification ok Drop test 1 0 m in height Drop the module on the marble terrace with one surface facing downwards six surfaces should be tested Operation mode no power no package IEC6006 8 ...

Страница 54: ...a EPA must have an ESD floor whose surface resistance and system resistance are greater than 1 x 104 Ω while less than 1 x 109 Ω The EPA must have a sound ground system without loose ground wires and the ground resistance must be less than 4 Ω The workbench for handling ESD sensitive components must be equipped with common ground points the wrist strap jack and ESD pad The resistance between the j...

Страница 55: ...ouch IC chips boards modules and other ESD sensitive components and assemblies must wear ESD wrist straps ESD gloves or ESD finger cots properly Engineers that sit when handling the components must all wear ESD wrist straps Noticeable ESD warning signs must be attached to the packages and placement areas of ESD sensitive components and assemblies Boards and IC chips must not be stacked randomly or...

Страница 56: ...ust be stored and sealed properly in vacuum package under a temperature below 40 C and the relative humidity less than 90 in order to ensure the weldability within 12 months 6 3 Moisture Sensitivity The moisture sensitivity is level 3 After unpacking the module must be assembled within 168 hours under the environmental conditions that the temperature is lower than 30 C and the relative humidity is...

Страница 57: ...oving storing and processing the product must comply with IPC JEDEC J STD 033 6 4 Dimensions Figure 6 1 shows the dimensions of the module in details Figure 6 1 Dimensions Unit mm Top view Bottom view 6 5 Packaging HUAWEI LGA module uses five layers ESD pallet anti vibration foam and vacuum packing into cartons The tray specification complies with Jedec_Tray_DGuide4 10D ...

Страница 58: ...HUAWEI MU509 65 HSDPA LGA Module Hardware Guide Mechanical Specifications Issue 01 2016 04 08 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 58 Figure 6 2 ESD pallet Unit mm ...

Страница 59: ... Copyright Huawei Technologies Co Ltd 59 The following figure shows the packaging Figure 6 3 The packaging Module quantity per tray 4 x 9 36 pcs tray Use vacuum packages five trays per carton module quantity per carton 5 x 36 180 pcs carton 8 middle cartons per large carton Module quantity per large carton 180 x 8 1440 pcs carton ...

Страница 60: ...gure 6 4 Design of the solder pads on customers PCBs Unit mm 6 6 3 Solder Mask Non Solder Mask Defined NSMD is recommended In addition the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved The solder mask must be 100 µm 150 µm larger than the pad that is the single side of the solder mask must be 50 µm 75 µm larger than the pad The spe...

Страница 61: ...the thermal design of the device to speed up heat dissipation For thermal characteristics of the module you can refer to Operating and Storage Temperatures Take the following heat dissipation measures The copper size on the PCB should be 70 mm x 70 mm or larger All copper ground layers of the PCB must be connected to each other through via holes Increase the quantity of the PCB ground planes The g...

Страница 62: ...k is installed above the shielding case you should attach the thermal conductive material between the shielding case and the heat sink if the heat sink is installed below the bottom side of the customer PCB you should attach the thermal conductive material between the customer PCB and the heat sink as shown in Figure 6 6 and Figure 6 7 Preferably we recommend the heat sink be installed below the b...

Страница 63: ...re recommended Use reflow ovens or rework stations for soldering because LGA modules have large solder pads and cannot be soldered manually 6 8 2 Stencil Design It is recommended that the stencil for the LGA module be 0 12 mm in thickness For the stencil design see the following figure Figure 6 8 Recommended stencil design of LGA module Unit mm The stencil design has been qualified for HUAWEI main...

Страница 64: ...r s development board For the soldering temperature of the LGA module see the following figure Figure 6 9 Reflow profile 240 300 180 217 165 120 60 0 s C 60s 100s 45s 80s 235 C Tmax 245 C Table 6 2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 40 C 165 C Heating rate 0 5 C s 2 C s Soak zone 165 C 217 C t1 t2 60s 100s Reflow zone 217 C t3 t4 45s 80s Peak reflow temperature 235 ...

Страница 65: ...ording to Table 6 1 6 9 3 Removing of the Module The solder is molten and reflowed through heating during the module removing process The heating rate must be quick but controllable in order to melt all the solder joints simultaneously Pay attention to protect the module PCB neighboring devices and their solder joints against heating or mechanical damages The LGA module has many solder pads and th...

Страница 66: ...ht installation direction of the module and the reliability of the electrical connection with the PCB It is recommended that the module be preheated in order to ensure that the temperature of all parts to be soldered is uniform during the reflow process The solder quickly reflows upon heating so the parts are soldered reliably The solder joints undergo proper reflow duration at a preset temperatur...

Страница 67: ...7 7 Certifications 7 1 About This Chapter This chapter gives a general description of certifications for MU509 65 7 2 Certifications Table 7 1 shows certifications the MU509 65 module has been implemented For more demands please contact us for more details about this information Table 7 1 Product certifications Certification Model name MU509 65 FCC PTCRB IC ...

Страница 68: ...e Medical Device Area with Inflammables and Explosives Traffic Security Airline Security Safety of Children Environment Protection WEEE Approval RoHS Approval Laws and Regulations Observance Care and Maintenance Emergency Call Regulatory Information 8 2 Interference Power off your wireless device if using the device is prohibited Do not use the wireless device when it causes danger or interference...

Страница 69: ...hemical products Area where the air contains chemical substances and particles such as granule dust or metal powder Area indicated with the Explosives sign Area indicated with the Power off bi direction wireless equipment sign Area where you are generally suggested to stop the engine of a vehicle 8 5 Traffic Security Observe local laws and regulations while using the wireless device To prevent acc...

Страница 70: ...al that your wireless device gets hot when you use or charge it Before you clean or maintain the wireless device stop all applications and power off the wireless device Use your wireless device and accessories with care and in clean environment Keep the wireless device from a fire or a lit cigarette Protect your wireless device and accessories from water and vapour and keep them dry Do not drop th...

Страница 71: ... wireless device for essential communications 8 14 Regulatory Information The following approvals and notices apply in specific regions as noted 8 14 1 FCC Statement This device complies with Part 15 of the FCC Rules Operation is subject to the following two conditions 1 this device may not cause harmful interference and 2 this device must accept any interference received including interference th...

Страница 72: ...R ESE R VED R ESE R VED G P IO G P IO G P IO G P IO G P IO G P IO G P IO G P IO N C N C N C N C JT A G _R T C K JT A G _T C K JT A G _T D I JT A G _T D O JT A G _T MS JT A G _T R S T _N N C N C N C N C N C N C N C N C N C N C LE D_ M O D E LE D_ S T A T U S M IC1_ N M IC1_ P M IC2_ N M IC2_ P N C N C N C N C N C N C P C M _CL K P C M _D IN P C M _D O U T P C M _SY N C N C N C N C N C N C N C S IM ...

Страница 73: ...oject 8PSK 8 Phase Shift Keying ADC Analog To Digital Converter AMPR Additional Maximum Power Reduction AP Access Point AUX Auxiliary BC Band Class BER Bit Error Rate BLER Block Error Rate BIOS Basic Input Output System CCC China Compulsory Certification CDMA Code Division Multiple Access CE European Conformity CMOS Complementary Metal Oxide Semiconductor CPU Central Processing Unit CS Circuit Swi...

Страница 74: ... Area ESD Electrostatic Discharge EU European Union EVDO Evolution Data Optimized FCC Federal Communications Commission FDD Frequency Division Duplex GMSK Gaussian Minimum Shift Keying GPIO General Purpose I O GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile Communication GLONASS Global Navigation Satellite System GNSS Global Navigation Satellite System ...

Страница 75: ...ng Scheme MPR Maximum Power Reduction MO Mobile Originated MT Mobile Terminated NC Not Connected NTC Negative Temperature Coefficient NSMD Non Solder Mask Defined OC Open Collector PA Power Amplifier PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PDU Protocol Data Unit PID Product Identity PMU Power Management Unit PS Packet Switc...

Страница 76: ...ology TBD To Be Determined TDD Time Division Duplex TD SCDMA Time Division Synchronous Code Division Multiple Access TIS Total Isotropic Sensitivity TTFF Time to First Fix TVS Transient Voltage Suppressor TX Transmit UART Universal Asynchronous Receiver Transmitter UL Up Link UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VID Vend...

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