HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Mechanical Specifications
Issue 01 (2016-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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with 0.6 mm. The minimum distance between the LGA module and the PCB edge
is 0.3 mm.
When the PCB layout is double sided, the LGA module must be placed on the
second side for assembly; so as to avoid module dropped from PCB or
component (located in module) re-melding defects caused by uneven weight.
Figure 6-5
PCB Layout (Unit: mm)
6.7 Thermal Design Solution
When the module works in the maximum power condition, the module has high power
consumption (for details, see
Power Consumption). To improve the module reliability
and stability, focus on the thermal design of the device to speed up heat dissipation.
For thermal characteristics of the module, you can refer to Operating and Storage
Temperatures.
Take the following heat dissipation measures:
The copper size on the PCB should be 70 mm x 70 mm or larger.
All copper ground layers of the PCB must be connected to each other through
via-holes.
Increase the quantity of the PCB ground planes.
The ground planes should be as continuous as possible.
If a fan is deployed, place the module at the cold air inlet.
Use heat sink, thermal conductive material and product enclosure to enhance the
heat dissipation of the module.
−
Use anodized heat sink on the shielding case or the customer PCB on bottom
side for optimal heat dissipation. The recommended heat sink dimensions are
70 mm x 70 mm x1 mm or larger.
−
The material of the heat sink should adopt the higher thermal conductivity
metallic materials, e.g. Al or Cu.
