IT3/IT5
Connector System
T
IPS FOR
SMT
A
SSEMBLY
Document Number:
ETAD-F0458
Revision 3.10
Page
61
of
73
Reflow:
Defects rela ted to reflow include:
R
e
fl
o
w
Failure Mode
Suggested Action
Col d s older joints – onl y
some portions of
component affected
Verify profile.
Check for proper nozzle on ma chine.
Check position of PWB with respect to nozzle and
bottom heater.
Col d s older joints – enti re
component affected
Verify profile
Verify s older alloy in pas te (tin-lead or lead-free)
Check loca tion of trigger thermocouple
Defects (bri dges or opens)
nea r the corners of the
component
Shorten ti me to peak temperature of thermal profile.
Keep del ta T a cross component under 10 degrees .
Pa cka ge wa rpa ge
Shorten ti me to liquidus of thermal profile.
Ensure pa rts a re dry
Poor solder paste fusion
Shorten ti me to liquidus of thermal profile.
Use ni trogen as reflow medium
Hea d-In-Pillow
Shorten ti me to liquidus of thermal profile
Ensure balls a re not contamina ted or oxi dized
Nea rby components
affected
If seconda ry reflow or cha rring of flux residue occurs on
nea rby components , shield them from the hea t/air flow
of the rework nozzle.
Solder in via
Check solder mask for da mage
Do not re-use recepta cles . If processing defects requi re rework, remove the
IT3/IT5
recepta cle
from the PWB and repla ce i t wi th a new one.
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
