IT3/IT5
Connector System
T
IPS FOR
SMT
A
SSEMBLY
Document Number:
ETAD-F0458
Revision 3.10
Page
56
of
73
Mounting Receptacle
Mating Receptacle
11.3 Reflow
Defects that appear after the reflow process may or may not be attributed to the process itself.
Many factors can affect the formation of defects during reflow soldering. If solder defects are
found, all sources should be investigated before any modifications are made to the reflow
profile.
Solder Bridges:
Solder shorts
, or
bridges
, occur when two or more adja cent conductors a re
connected by s older.
S
o
ld
e
r
Sh
o
rt
s
Possible Cause
Suggested Action
Poor solder paste pri nt
Check pas te print quali ty
Pla cement pressure is too hi gh and
deforms sol der paste deposit
Check pla cement pressure and depth of
pla cement
Reflow profile taking too long to rea ch
liquidus tempera ture, causing hot
slump and/or and exhaus ting the flux
Shorten ti me to reach liquidus by ramping
fas ter or limi ting soak ti me
Component shi fting during tra nsport
Check conveyor for rapid sta rts and stops ,
and any component movement during
transport or pla cement
IT3
M
-300S-BGA
IT3
D
-300S-BGA
Chamfer
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
