IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
43
of
73
Rework processing of the
IT3/IT5
connector receptacle is similar to that of other high-value
BGA devices. Thermal profiles should be developed specifically for the receptacle, best
available practices should be used for site redressing, and receptacles that are removed from
PWB’s should be discarded and not reused.
Rework on devices peripheral to an IT3/IT5 interposer may physically damage and melt the
outer walls of the interposer. Please remove the interposer for such rework. Interposer
removal procedure is on page 73.
Unless specifically mentioned, IT3 and IT5 share the same capability and requirement.
10.1 Equipment and Supplies
•
Forced Hot Air BGA Repair Station with bottom side heaters, properly sized (custom)
nozzle, vacuum pickup/low placement force capability, and split vision alignment
system
•
Adhesive polyimide (tape) discs 3/8” or 1 cm diameter
•
Liquid flux
•
Non-contact, vacuum redressing tools
•
Rework stencil, mini-squeegee, and solder paste
•
Hand-held inspection device(s)
10.2 Profiling
Bottom-Side Heaters
PCB
IT3 BGA
Connector
Nozzle and Topside Heater
Bottom-side
Pin Support
Section 10 Rework
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
