Removal and replacement procedures 70
o
Front I/O assembly removal in an SFF chassis
To replace the component, reverse the removal procedure.
Quick-release latch rack ear assembly
WARNING:
To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION:
To prevent damage to electrical components, take the appropriate anti-static
precautions before beginning any installation, removal, or replacement procedure. Improper
grounding can cause electrostatic discharge.
To remove the component:
1.
Power down the server (on page
27
).
2.
Remove all power:
a.
Disconnect each power cord from the power source.
b.
Disconnect each power cord from the server.
3.
Remove the server from the rack (on page
30
).
4.
If installed, remove the security bezel ("
Remove the security bezel (optional)
" on page
27
).
5.
Remove the access panel ("
Access panel
" on page
37
).
6.
If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage
("
Remove the PCI riser cages
" on page
31
).
7.
Release the front I/O cabling from the server:
a.
Detach the ambient thermal sensor cable from its clip.
b.
Release the ambient thermal sensor cable from the front chassis cable clip.
c.
Disconnect the USB 3.0 cable.
d.
Disconnect the front I/O assembly cable.
Содержание ProLiant DL180 Gen9
Страница 13: ...Customer self repair 13 ...
Страница 14: ...Customer self repair 14 ...
Страница 15: ...Customer self repair 15 ...
Страница 18: ...Illustrated parts catalog 18 ...
Страница 23: ...Illustrated parts catalog 23 ...
Страница 117: ...Cabling 117 Item Description 5 Fan 5 cable GPU power drive cabling FlexibleLOM sideband signal cabling ...
Страница 121: ...Cabling 121 Item Description 3 USB 3 0 connector cable ...
