HP Integrity rx1620, Руководство по эксплуатации

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System Information
System Board
Appendix B
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and the other 4 DIMM slots connect to cell 1. For early Nemesis prototypes, 8 DIMM connectors will be loaded
onto system boards to facilitate power characterization; if actual power consumption is low enough, a change
request could be entertained to increase the DIMM count to 8.
The memory bus clock speed is 125MHz, and the data transfer rate is 250Mtransfers/second as data is
transmitted on both edges of the clock. The peak data bandwidth for this memory subsystem design is 8 GB/s.
DIMMs must be loaded in pairs. Memory is protected by data error correcting codes (ECC). The hardware
implementation supports the chip-spare for specific four-DIMM configurations.
The minimum amount of memory that can be installed is 512MB (2-256MB DIMMs). The maximum amount
of memory that can be installed is dependent on the largest DIMM size (density) qualified for use. 16GB is the
maximum memory (based on 2GB DIMMs).
The DIMMs used must be low-profile (1.2") DIMMs, to fit into the 1U chassis. The DIMMs are standard
DDR2100 registered DIMMs. Only DIMMs qualified by HP for the hp Integrity rx1620 Server platform will
be supported.
Architecture
The memory interface supports two DDR cells, each of which is 144 data bits wide. The memory subsystem
physical design uses a comb-filter termination scheme for both the data and address/control buses. This part
of the topology is similar to other DDR designs in the computer industry. Clocks are distributed directly from
the memory interface; each clock pair drives 2 DIMMs.
Memory data is protected by Error Correcting Code (ECC). 8 ECC bits per DIMM protect 64 bits of data. The
use of ECC allows correction of single-bit errors, and detection of multi-bit errors. DIMMs without ECC will
not be qualified or supported.
The memory subsystem features: address parity, address buffering, clock buffering, and industry standard
SPD (Serial Presence Detect), IEEE 1149.1 Boundary Scan, and power bypassing near the memory
components. The memory features x4 chip-spare and x8 detect. The memory subsystem does not support hot
spare, mirroring, or hot-plug. The memory subsystem uses 1x direct attach mode, and does not use
multiplexers.
The Memory Block Diagram indicates the recommended load order for DIMM pairs; DIMM0A/B should be
loaded first, followed by DIMM1A/B, and so on.