2-1
2
Installation Preparations
Environment Requirements
The H3C SecPath series security gateways are designed for indoor application. To guarantee the
normal operation and prolong the service life of the device, the installation site must meet the
requirements mentioned hereunder.
Temperature and Humidity
The temperature and humidity in the equipment room shall be maintained at an appropriate level.
z
A long-time high relative humidity will quite likely result in poor insulation performance, electric
leakage, mechanical property change, and corrosion.
z
A long-term low relative humidity will result in looseness of fastening screws owing to shrinkage of
insulation washers, or electrostatic discharge (ESD), which may damage the CMOS circuit on the
device.
z
A high temperature will speed up the aging of insulation materials, which greatly lower the device’s
reliability and shortens the service life.
Table 2-1 lists the requirements on temperature and humidity for the V100-E. .
Table 2-1
Temperature and humidity requirements in the equipment room
Temperature
Relative humidity
0
°
C to 45
°
C (32
°
F to 113
°
F)
10% to 95% (noncondensing)
Cleanness Requirements
Dust is harmful to the safe operation of the device. Dust on the chassis may result in static adsorption,
which causes poor contact between metal connectors or joints. The poor contact not only shortens the
service life of the device, but also brings about communication failures. Especially under the condition
of low indoor humidity, static adsorption is more likely to occur.
The equipment room must be free of explosive, electrically and magnetically conductive, and corrosive
dust. The following table lists the limit on dust particles.
Table 2-2
Limitation on dust concentration and diameter in the equipment room
Mechanical active
material
Unit
Content
Dust particle
Particle/m³
≤
3 × 10
4
(No visible dust on desk in three days)
Note: Dust particles diameter
≥
5 µm
