MT6M16534
© Fuji Electric Co., Ltd. All rights reserved.
3. Through hole design for PCB
This chapter describes the through hole design for PCB attaching to the product.
3-1
Figures 3-1 to 3-3 show examples of recommended through hole dimensions and through hole layout
designs.
• The through hole dimensions are the inner diameter after plating (dimension unit: mm).
• If the terminal cross-sectional dimensions / through hole clearance is too large, solderability may be
impaired. Also, if the land diameter is too large, solder bridges are likely to occur.
• The hole size and land size should be optimized as appropriate, taking into consideration the printed
circuit board processing accuracy and mounting method.
Fig. 3-1 Control side through hole dimensions
Fig. 3-2 Power side through hole dimensions
Fig. 3-3 Through hole layout
Through hole
Land
Through hole
Land
