MT6M16534
© Fuji Electric Co., Ltd. All rights reserved.
6. Heat sink selection
This chapter describes the heat sink selection for the product.
6-1
• The junction temperature
T
vj
should not exceed the maximum junction temperature rating for safe
operation. Heat sink (cooling device) should be designed to ensures that
T
vj
is always below the
maximum junction temperature rating.
• If the IGBT or FWD junction temperature is higher than the maximum junction temperature rating, it
might cause damage to the chips. Some types of the products have the over heating (OH)
protection function which works when the LVIC chip temperature exceeds the maximum junction
temperature rating. However, if the temperature rises too quickly, the OH protection might not work.
• When selecting a heat sink, please verify the chip temperature
T
vj
by measuring
T
c
at the position
shown in Figure 6-1, and calculating the
T
vj
from device power dissipation and thermal resistance.
In addition, this product has a built-in temperature sensor, and
T
vj
can be confirmed by the analog
voltage that is output according to the LVIC chip temperature. Please refer to it when selecting the
heat sink.
• For more detail design, please refer to “IGBT Module Application Manual (REH984e)” and “Small
IPM Application Manual (MT6M15234
b)”.
1
Selection
Fig. 6-1 Temperature sensing and
T
c
measurement points
