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MT6M16534

• The product’s temperature during soldering might exceed the maximum temperature rating. To

prevent damage to the product and to ensure reliability, please use the following soldering

temperature.

7. Soldering to Printed Circuit Board

This chapter describes the soldering to printed circuit board for the product.

7-1

Table 7-1. Soldering temperature and duration

• A stopper is provided on the terminal to prevent the immersion depth of the terminal from coming

too close to the product body. Use this stopper to secure the required distance from the printed

circuit board and prevent the product body from being immersed in the solder bath during flow

soldering.

• It is not recommended to reuse the product after it is removed from the printed circuit board

because there is a possibility that the removed product was subjected to thermal or mechanical

damage during the removal process.

Methods

Soldering Temp. & Time

Dip soldering

260

C, 10

1sec

Содержание P642 Series

Страница 1: ...MT6M16534 Mounting Instruction Small IPM Intelligent Power Module P642 Series 6MBP XT 060 50 July 2022...

Страница 2: ...otor or fan motor for Room Air Conditioner Inverter for Compressor motor for heat pump applications If you need to use a semiconductor product in this application note for equipment requiring higher r...

Страница 3: ...all IPM from the stick 2 3 Chapter 3 Through hole design for PCB 3 1 Chapter 4 Spacer 4 1 Chapter 5 Application of thermal grease 5 1 Chapter 6 Heat sink selection 6 1 1 Selection 6 1 2 Shape 6 2 3 Mo...

Страница 4: ...rm the outer box shall be avoided even when it is packed in the outer box Transport the cardboard box with the appropriate side facing up This is to prevent unexpected stress being applied to the prod...

Страница 5: ...pins it may cause a strong impact to the product causing the product terminals to be deformed or damaged Remove the pin with the tube opening facing up It is recommended to use a remover removal jig t...

Страница 6: ...the specifications In particular when removing it out from the tube it is most likely to cause electrical damage to the product When removing the product do not strongly collide the products with each...

Страница 7: ...fter plating dimension unit mm If the terminal cross sectional dimensions through hole clearance is too large solderability may be impaired Also if the land diameter is too large solder bridges are li...

Страница 8: ...t during soldering to printed circuit board it is recommended to support the product at the hatched area as shown in Fig 4 1 Select a spacer material that does not cause contamination or corrosion 4 S...

Страница 9: ...k the extent of spreading In the case of liquid cooling the temperature difference temperature gradient between the heat sink temperature and the temperature inside the product becomes large When moun...

Страница 10: ...ion which works when the LVIC chip temperature exceeds the maximum junction temperature rating However if the temperature rises too quickly the OH protection might not work When selecting a heat sink...

Страница 11: ...er components to the heat sink ensure the flatness of the components mounted on the printed circuit board before mounting 3 Mounting tightening 2 Shape Fig 6 2 The measurement point of heat sink flatn...

Страница 12: ...e and duration A stopper is provided on the terminal to prevent the immersion depth of the terminal from coming too close to the product body Use this stopper to secure the required distance from the...

Страница 13: ...product 8 1 Package No P642 This figure shows the view from the aluminum base surface Metal mask thickness t 200 m Target grease thickness t approx 100 m Aluminum base centerline Fig 8 1 Stencil mask...

Страница 14: ...ng the heat sink as shown in Fig 8 2 it is possible to secure a clearance distance of 5 08 mm or more in accordance with UL 8 2 2 Isolation distance of heat sink Fig 8 2 Isolation distance of heat sin...