Fuji Electric P642 Series Скачать руководство пользователя страница 4

MT6M16534

© Fuji Electric Co., Ltd. All rights reserved.

• The product should be stored at a normal temperature of 5 to 35

o

C and relative humidity of 45 to

75%, otherwise the product might be corroded or destructed, or its lifetime. If the storage area is

very dry, a humidifier may be required. In such a case, use only deionized water or boiled water,

since the chlorine in tap water may corrode the leads.

• In case of storage environment with rapid temperature changes, condensation will be occurred on

the surface of the product. In order to avoid the condensation, the product shall be stored in steady

temperature environment if possible.

• Should not be stored or used in an environment where it is exposed to acids, organic substances, or

corrosive gas (hydrogen sulfide, sulfurous acid gas etc.) or in a dusty place.

• When stored, it is necessary to prevent external pressure to the product. Stacking that may deform

the outer box shall be avoided even when it is packed in the outer box.

• Transport the cardboard box with the appropriate side facing up. This is to prevent unexpected

stress being applied to the product, which may cause bending of the terminals or distortion in the

resin package of the product. Throwing or dropping the product can cause severe damage to the

product. Also, it is necessary to pay attention to rain and freezing to avoid wetting, as it may cause

damage or destruction. The environmental conditions such as temperature and humidity during

transportation described in the specifications shall be strictly observed.

• The product should be stored with the lead terminals remaining unprocessed. It is necessary to

avoid rusting etc. due to scratches during processing, resulting in poor soldering.

• The containers and bags for storing the product should be non-static or conductive.

• Under the above storage condition, use the product within one year.

1. Precautions during transportation and storage

This chapter describes the precautions during transportation and storage for the product.

1-1

Содержание P642 Series

Страница 1: ...MT6M16534 Mounting Instruction Small IPM Intelligent Power Module P642 Series 6MBP XT 060 50 July 2022...

Страница 2: ...otor or fan motor for Room Air Conditioner Inverter for Compressor motor for heat pump applications If you need to use a semiconductor product in this application note for equipment requiring higher r...

Страница 3: ...all IPM from the stick 2 3 Chapter 3 Through hole design for PCB 3 1 Chapter 4 Spacer 4 1 Chapter 5 Application of thermal grease 5 1 Chapter 6 Heat sink selection 6 1 1 Selection 6 1 2 Shape 6 2 3 Mo...

Страница 4: ...rm the outer box shall be avoided even when it is packed in the outer box Transport the cardboard box with the appropriate side facing up This is to prevent unexpected stress being applied to the prod...

Страница 5: ...pins it may cause a strong impact to the product causing the product terminals to be deformed or damaged Remove the pin with the tube opening facing up It is recommended to use a remover removal jig t...

Страница 6: ...the specifications In particular when removing it out from the tube it is most likely to cause electrical damage to the product When removing the product do not strongly collide the products with each...

Страница 7: ...fter plating dimension unit mm If the terminal cross sectional dimensions through hole clearance is too large solderability may be impaired Also if the land diameter is too large solder bridges are li...

Страница 8: ...t during soldering to printed circuit board it is recommended to support the product at the hatched area as shown in Fig 4 1 Select a spacer material that does not cause contamination or corrosion 4 S...

Страница 9: ...k the extent of spreading In the case of liquid cooling the temperature difference temperature gradient between the heat sink temperature and the temperature inside the product becomes large When moun...

Страница 10: ...ion which works when the LVIC chip temperature exceeds the maximum junction temperature rating However if the temperature rises too quickly the OH protection might not work When selecting a heat sink...

Страница 11: ...er components to the heat sink ensure the flatness of the components mounted on the printed circuit board before mounting 3 Mounting tightening 2 Shape Fig 6 2 The measurement point of heat sink flatn...

Страница 12: ...e and duration A stopper is provided on the terminal to prevent the immersion depth of the terminal from coming too close to the product body Use this stopper to secure the required distance from the...

Страница 13: ...product 8 1 Package No P642 This figure shows the view from the aluminum base surface Metal mask thickness t 200 m Target grease thickness t approx 100 m Aluminum base centerline Fig 8 1 Stencil mask...

Страница 14: ...ng the heat sink as shown in Fig 8 2 it is possible to secure a clearance distance of 5 08 mm or more in accordance with UL 8 2 2 Isolation distance of heat sink Fig 8 2 Isolation distance of heat sin...

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