Rittal Liquid Cooling Package
17
5 Assembly and siting
5
When installing the unit the space required must be tak-
en into account and must not be impaired by compo-
nents or installations at the installation site.
5.2.2
Fit the attenuators
If applicable, attenuators may be fitted underneath the
unit for vibration insulation. For this purpose, the entire
LCP DX must be lifted up.
Lift up the LCP DX using appropriate lifting gear with
an adequate load capacity.
Attach the attenuators underneath the unit.
Slowly and carefully lower the LCP DX onto the atten-
uators.
5.2.3
Dismantle the side panels
If there is a side panel or partition mounted on the server
enclosure side to which the LCP DX is to be bayed, this
must be removed first.
Loosen and remove the 8 assembly screws found on
each side panel of the server enclosure.
Remove all side panel securing elements from the side
of the server enclosure onto which the LCP DX is to be
bayed.
Dismantle both side panel mountings from the upper
mounting rail of the server enclosure, using an appro-
priate lever.
Loosen and remove the screws on both of the side
panel mounting brackets (top and bottom) in the mid-
dle of the mounting rail.
Loosen and remove the screws from the 6 side panel
holders on the side mounting rails.
5.2.4
Seal the server enclosure
In order to ensure targeted air routing in the system, the
server enclosure is vertically divided into hot air and cold
air zones by sealing the 482.6 mm (19") level.
Proceed as follows to seal the 482.6 mm (19") level:
If the server enclosure is only partially configured, seal
the open sections of the 482.6 mm (19") level using
blanking plates. Screw these tightly into the server
rack from the front.
Fasten the wider (Model No. 3301.370 / 3301.320) of
the two foam strips from the LCP DX accessories onto
one of the front uprights of the server rack from the
outside. Make sure to install this strip on the side of the
server enclosure onto which the LCP DX is to be
bayed.
If you are only baying the LCP DX on one side:
Fasten the narrower (Model No. 3301.380 / 3301.390)
of the two foam strips from the LCP DX accessories
onto one of the front uprights of the server rack from
the outside. Make sure to install this strip on the side
of the server enclosure which will again be sealed by a
side panel.
If the server enclosure contains devices which require
cooling via sideways air throughput (e.g. switches, rout-
er, etc.), cut-outs must be incorporated into the foam
strips.
To do this, cut out a piece of the foam strip using a
sharp knife.
If several devices which require sideways air through-
put are included, cut out several pieces of the foam
strip, as is appropriate, so that, ultimately, there is a
cut-out in the foam to the left or right at the height of
each such device in the server rack. Ensure that there
are no gaps on the hot air side of the devices (fig. 14,
item 3).
Using a sharp knife, cut additional pieces from the
foam strip that are at least as long as the height of the
built-in devices.
Attach the foam strips to the cold air side of the devic-
es set back towards the rear (fig. 14, item 5), making
sure that all fans built into the devices can draw air and
that none of them are blocked.
Danger! Injury due to falling loads!
Do not stand under suspended loads
when transporting the unit with a hoist
trolley, a forklift, or a crane.
Caution! Risk of injury!
Attenuators must only be attached to the
LCP DX by suitably trained experts.
Caution! Risk of injury!
The side panel holders have sharp-
edged teeth, which enable earthing of
the server enclosure's side panel.
Caution! Risk of injury!
There is the risk of being cut when foam
strips are cut to size. Wear your personal
protection equipment!
Note:
Blanking plates in a range of height units (U),
together with both narrow and wide foam
strips and air baffle plates, are available as
Rittal accessories (see section 13 "Accesso-
ries").
Note:
The foam strips can be attached between the
front and rear uprights of the server rack
along the entire depth of the devices with
sideways air throughput (fig. 14, item 1).
