Formica Group Technical Guide
| 6
FTB-0918 | Rev 2 | 6/20
TECHINCAL GUIDE USE & CARE, WARRANTY, AND INSTALLATON GUIDE
INTENTEK
™
WIRELESS CHARGING SURFACE
• Approved substrate that is at least ¾" thick
• Panel layup equipment
• Approved adhesives - Polyvinyl acetate (PVA), Polyurethane
(PUR), Contact Adhesives
• CNC machine
• CAD program for CNC machine
• Phillips head screwdriver
• A table or work surface
• Depth gauge
• Cleaning cloths
• Cleaner (as recommended by adhesive manufacturer to remove
any dried adhesive)
APPROVED ADHESIVES
Polyvinyl acetate (PVA), Polyurethane (PUR), Contact Adhesive
IF MULTIPLE ELECTRONICS MODULES ARE TO BE
CONNECTED, ADDITIONAL TOOLS
• Wire cutter
• Wire stripper
• Small slotted screwdriver
• Two colors of 20 AWG solid core wire or thicker
• Sheathing coverage for wire channels
• 3" alignment screws as needed
• Cradle for AC/DC converter box with screws as needed (to hold
adapter under top)
• Alternative length AC Adapter or extension cord as needed
• Edge bander or other method to finish table/counter edging
as needed
• Table/counter base as needed
IMPORTANT INSTALLATION TIPS & REMINDERS
• For fabrication techniques specific to working with High Pressure
Laminate, refer to the
Guide for High Pressure Laminate.
• Material, equipment, and workmanship should conform to the
Formica Group recommended standard practices, conditions,
procedures, and recommendations as specified by ANSI/NEMA
LD3-2005, Architectural Woodwork Quality Standards and ANSI
A161.2-1998 Standards.
• Fabricating with peel coat on surface is recommended.
• Router base should be clean and free of burrs and debris. All
work surfaces should be clean, flat, and free of burrs. Confirm
laminate, backer, and substrate are dry, clean and free of all
grease, dust, and foreign matter.
• Before beginning, confirm storage, acclimation and fabrication
conditions outlined above have been met.
BASIC INSTALLATION STEPS FOR PANEL
LAY-UP AND CNC FABRICATION
1. PANEL LAY-UP
1A)
SUBSTRATE:
Use industrial substrate suitable for HPL (high
pressure laminate) bonding.
1B)
CLEAN:
All surfaces of all materials including substrate,
Intentek
™
Laminate sheet and backing sheet to remove any debris
which would cause telegraphing. Do not remove the 5"x5" masking
from charging zones on the back of the Intentek
™
Laminate face
sheet. If 5"x5" masking has been removed accidently, add masking
tape, that does not have too much tack, over contact pads before
proceeding.
1C)
ADHESIVE
: Apply adhesive to the substrate per adhesive
manufacturer instructions for bonding HPL (high pressure laminate). It
is advised that a test is done to assure bond.
1D)
INTENTEK
™
LAMINATE FACE SHEET INDEXING:
Using the
marked reference edge, position face sheet with a consistent ¼"
(0.25") overhang on the substrate length and consistent ¼" (0.25")
overhang on the substrate width.
NOTE
: Face sheet must extend
beyond the substrate and backer edge to maintain the reference
edge for the CNC operation.
Keep 6'x6' Masking in Place
Do Not Layup Panel without Masking
*Corded/stranded wire is not recommended