CPC505
C P C 5 0 5 U s e r M a n u a l
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3 Functional description
3.1 Features of operation of functional nodes
CPU Intel Xeon E-2276ML / Intel Core i3-9100HL
64-bit Intel microprocessor, manufactured in accordance with the 14 nm process technology, with
TDP of 25 W. Includes up to 6 improved 9
th
generation Intel Xeon / Core i3 cores, dual-channel 64-
bit DDR4 SDRAM memory controller (up to 32 GB, 2666) with ECC support, advanced graphics
subsystem with 2D/3D acceleration GT2, input/output subsystem PCI-Ex16 Gen3. State-of-the-art
DDI high-speed graphics interfaces.
The processor is made in BGA1440 socket with a size of 42x28 mm.
PCH Intel CM246
Highly integrated interface controller that includes standard peripherals of IBM PC AT platform and
modern high-speed interfaces PCI-E Gen3, SATA 6Gps, USB 2.0/3.1. Implemented in the BGA874
enclosure.
DDR4 SDRAM
The board can be equipped with (soldered) 36 x DDR4 2666 SDRAM chips with a total capacity of
up to 32 GB. Operating mode is dual-channel with ECC support.
BIOS
2 x 128 Mb SPI-Flash microchips are used to store the main (working) copy of the BIOS.
RTC, CMOS
The real time clock is built into the PCH CM246. The clock functionality is ensured by a CR2032
lithium battery that is mounted on the board when the power supply is switched off. BIOS settings
are stored in non-volatile FRAM.
SPI FRAM
Non-volatile 32 KB memory (Ramtron, FM25L256, SPI) needed to store user data (used as a
substitute for the standard non-volatile RAM). The manufacturer guarantees 100 trillion read/write
cycles, which as a part of this application corresponds to ~340 years of operation (in case of
continuous cyclic read/write procedure).
BGA SSD
The board has a 32GB SATA III 6 Gbps SSD in a 16 x 20 mm Jedec MO-276 TFBGA enclosure.
Ethernet
