Epson S1D15722 Series, Техническое руководство

Страница: 9 / 77

4. PIN ASSIGNMENT
4 EPSON S1D15722D01B000 Technical Manual (Rev.1.1)
4. PIN ASSIGNMENT
4.1 Chip Assignment
Size
Item
X Y
Unit
Chip size 3.31
×
21.00 mm
Chip thickness 0.625 mm
Bump pitch 62 (Min.)
µ
m
1 to 5 45
×
85
µ
m
6 to 17,
19 to 44,
83,
85 to 98
90
×
109
µ
m
18,
48 to 82,
84
90
×
60
µ
m
45 to 47 90
×
45
µ
m
99 to 153
45
×
85
µ
m
154 to 481
90
×
35
µ
m
Bump size
PAD No.
482 to 531 45
×
85
µ
m
Bump height Typ. 17
µ
m
4.2 Alignment mark
Alignment coordinate
1
(1500.0, 9380.0)
µ
m
2
(1500.0, -9380.0)
µ
m
Mark size
a = 15
µ
m
b = 45
µ
m
Mark 1 Mark 2
b
b
a
a
a
a a a
• • • •
• • • • • •
• • • • • •
• •
• • • • •
• •
104
482
153
(0, 0)
531
1
103
•
• • • • • •
• •
• • • • •
• • • • • •
• •
• •
• • • •
481
•
• •
•
154 • • •
•
5
6
99
98
D1
57MD1
B
Die No.
Alignment Mark2
Alignment Mark1