INTELLIGEN MV DISPENSE SYSTEM
ENTEGRIS, INC.
INSTALLATION AND USE MANUAL P/N P92500 REV. A
35
Poor End of Dispense
If the problem is related to the end of the dispense, check the following:
Symptom
Problem
Solution
Droplet hangs down/drips
External stop valve closing
too late or parameters
require adjusting
Close the valve earlier by adjusting the close
time on the Recipe tab (Outlet Valve
Control), or adjust suckback settings.
Fluid cuts off too high in the nozzle
External stop valve closing
too quickly
Close the valve later by adjusting the close
time on the Recipe tab (Outlet Valve
Control), or adjust suckback settings.
No suckback
Bubbles in the dispense line
Ensure no bubbles are in the dispense line.
Inappropriate suckback
parameters on Recipe tab
Ensure there is enough time for the chemi-
cal to flow back. Higher viscosity chemicals
will require longer time.
For new system start-up, start with the low
suckback rate and high suckback volume. For
example: 0.05 cc/s and 0.5 cc respectively.
This gives the chemical 10s to flow back.
Optimize the parameters accordingly.
High Particle Counts on Wafer
If there are high particle counts, check the following:
Problem
Solution
Filter media is too open
Use smaller pore size filter.
Filter not being fully wetted during installation
or priming
Perform multiple purge cycles using higher than normal filtration
to completely wet the filter.
Filter lifetime exceeded
Replace filter.
Contaminated or old resist
Drain, flush and clean the entire system and fluid path.
Use new photochemical. See
Flushing the System
.
Resist Thickness
Typically, resist thickness problems are not related to the pump, but the coater system and nozzle settings.
Check the following items if there is a problem with resist thickness:
Symptom
Problem
Solution
Resist thickness non-uniform
Delay between end of dispense
and the final wafer spin
Correct wafer spin timing.
Nozzle not centered above wafer
Center nozzle.
Dried chemical on nozzle
Clean nozzle.
Nozzle too high or too low
above wafer
Adjust nozzle height. Typically 6 to 9 mm
above wafer. Position and dispense rate will
vary with fluid viscosity.
