27
Infrared
temperature
180
0
0
0
0
0
Constant time
300
0
0
0
0
0
Infrared
rate
3
0
0
0
0
0
Above reference temperature are for the lead-free products
Above are Intel lead-free BGA temperature references
If you want to dismounting the BGA chip, the cooling temperature can be set 0
I Announcements of BGA operation
1.After opening the power, firstly you should check whether the upper and
bottom hot air nozzles have cold wind If not, starting the power is strictly
prohibited, or the heaters will be burnt The bottom infrared heating areas are all
controlled by switch, and you can choose the bottom heating areas depend on the
PCB board size
2. You should set different temperature curves when repair different BGA,
each temperature should not higher than 300
℃
Lead-free rework setting
can refer to welding temperature curve of BGA tin bead
3. When demount BGA, the cooling fan and vacuum should be set to
automatic transmission,
The buzzer will warn automatically when temperature curve runs to the
end Meanwhile, dismounting the BGA from PCB board with vacuum
pen, and then dismounting the PCB board from the positioning frame
4. When welding the BGA chip, set the cooling fan to manual grade. close
vacuum After the temperature curve runs to the end, the buzzer will
alarm automatically, the cooling fan begins to cooling the BGA chip
and bottom heating zone, meanwhile, the warm heating head will blow
a cold wind Then elevate the upper heater, make the gap has 3-5mm
space between the bottom of nozzle and the upper surface of BGA chip
and keep cooling for 30-40 seconds, or move away the main heater after
the starting light is off, finally take away the PCB board from the
support
5.Before installation of BGA, it is necessary to check that if the PCB pad
and BGA tin bead are all in good condition It is necessary to check the
outlet after welding and to stop installation if you find something
unusual Go on welding after anything is normal, or the BGA and PCB
