Table 33. Thermal restrictions configuration (continued)
Configuration
Number
of
process
ors
Heatsink
Processor/
DIMM blank
DIMM
blanks
Maximum number of
DIMM blanks
Fan
Two 1U 2-pipe heat
sink for CPU=150
W/165 W FO*
Not required
Eight high performance
fans
Two 1U 2-pipe heat
sink for CPU=200/205
W
Not required
Required
22 blanks
PowerEdge
R640 (3.5 inch
hard drives x 4
with NVMe
drives x 2 in
the rear)
2
Two 1U standard heat
sink for CPU <= 165 W
Not required
Required
22 blanks
Eight standard fans
Two 1U 2-pipe heat
sink for CPU=155
W/165 W FO*
Two 1U 2-pipe heat
sink for
CPU=200/205W
NOTE:
*165 W and 150 W FO includes Intel Xeon Gold 6146, 6144, 6244 and 6246 processors.
Table 34. DCPMM thermal restrictions configuration
Configuration
TDP
Maximum ambient
temperature
Fan requirement
Heatsink Requirement
PowerEdge R640
2.5 inch x10 hard drives
(PCIe x3)
3.5 inch x4 hard drives
(PCIe x2/x3)
2.5 inch x8 hard drives
(PCIe x3/x2)
200/205 W
155/165 W FO*
165 W Gold 6146
150 W 6144 and 6244
150 W Gold 6240Y
30
o
C
High performance fans
High performance heat
sink
35
o
C
35
o
C
35
o
C
35
o
C
PowerEdge R640
2.5 inch x10 hard drives
(PCIe x3)
3.5 inch x4 hard drives
(PCIe x2/x3)
2.5 inch x8 hard drives
(PCIe x3/x2)
70 to 165 W
35
o
C
High performance fans
High performance heat
sink
NOTE:
When installing DCPMMs for systems that support 200W or higher wattage processors, the ambient
temperature of 30
o
C must be adhered to ensure proper cooling and to avoid excess processor throttling, which may
impact system performance.
Table 35. GPU thermal restrictions configuration
TDP(Watts)
PowerEdge R640 2.5 inch hard drives x 10 x2GPU
in slot 1,3
PowerEdge R640 (2.5 inch hard drives x 8
x3GPU)
Thermal restriction
at 30
o
C
Thermal restriction at 35
o
C
Thermal restriction
at 30
o
C
Thermal restriction at
35
o
C
200/205 W
155/165 W FO*
High performance
fans and High
Not supported
High performance
fans and High
Not supported
40
Technical specifications
