Data Modul eDM-COMB-CR6, Руководство пользователя

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Ordering Information
M odel N am e Part N o. D escription
eD M -CO M B -CR6-E-2276M E 12040447 CO M Express Type 6 B asic w ith Intel® Xeon® , CM 246 chipset, ECC
eD M -CO M B -CR6-i7-9850H E 12040448 CO M Express Type 6 B asic w ith Intel® Core® i7, Q M 370chipset
eD M -CO M B -CR6-i3-9100H L 12040449 CO M Express Type 6 B asic w ith Intel® Core® i5, Q M 370chipset
eD M -CO M B -CF6-CF 12029280 Active cooling solution, w ith fan
eD M -CO M B -CF6-CP 12029281 Passive cooling solution, w ithout fan
eD M -CO M B -CF6-CH 12029282 H eatspreader, 3 m m plate w ith 8 m m standoffs, flat surface
Hardware Features
Platform
The 9th G eneration Intel® Core™ processor fam ily are a 64-bit, m ulti-core processor (up to 6 cores) built on 14-nanom eter
process technology (Coffee Lake Refresh-H ).
CPU
The eD M -CO M B -CR6 supports all available Coffee Lake Refresh CPU s in FCB G A1440 package, 14nm , up to 45W TD P.

Package: 42 m m x 28 m m x 1.395 m m , FCB G A1440 c-states

Supported Features:

C-States: CO -C10

Intel® Virtualization Technology (Intel® VT)

Intel® Stream ing SIM D Extensions 4.2 (Intel® SSE4.2)

Intel® H yper-Threading Technology (Intel® H T Technology)

Intel® 64 Architecture

Execute D isable B it

Intel® Turbo B oost Technology 2.0

Intel® Advanced Vector Extensions 2 (Intel® AVX2)

PCLM U LQ D Q (Perform Carry-Less M ultiplication Q uad w ord) Instruction

Intel® Transactional Synchronization Extensions (Intel® TSX-N I)

PAIR – Pow er Aw are Interrupt Routing

G M M Scoring Accelerator

Intel® Processor Trace

H igh D efinition Contend Protection (H D CP) 2.2

Security Features:

Intel® Active M anagem ent Technology 12.0 (Intel® AM T 12.0)

Intel® Trusted Encryption Technology (Intel® TXT)

Intel® Advanced Encryption Standard N ew Instructions (Intel® AES-N I)

Intel® Security Key

SM EP – Supervisor M ode Execution Protection

Intel® B oot G uard

Intel® Softw are G uard Extensions (Intel® SG X)

Intel® M em ory Protection Extensions (Intel® M PX)
Memory

Tw o SO -D IM M sockets

M em ory type: D D R4, ECC/N on-ECC (Variants w ith Intel® CM 246 chipset support ECC m em ory)

Speed: up to 2666 M T/s

Size: up to 32 G B (2 x 16 G B )
Chipset

M obile Intel® 300 Series Chipset Q M 370, H M 370 and CM 246 PCH
Graphic & Media

G FX type: Intel® G en 9.5 G raphics Processing U nit (G T2)