Document Number: 002-00833 Rev. *L
Page 6 of 74
S29VS256R
S29VS128R
S29XS256R
S29XS128R
4.
Physical Dimensions/Connection Diagrams
This section shows the I/O designations and package specifications for the S29VS-R/S29XS-R.
4.1
Related Documents
The following document contains information relating to the S29VS-R/S29XS-R devices. Click on the title or go to
,
or request a copy from your sales office.
Considerations for X-ray Inspection of Surface-Mounted Flash Integrated Circuits
4.2
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data
integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.
4.2.1
44-Ball Very Thin Fine-Pitch Ball Grid Array, S29VS256R/S29XS256R/
S29VS128R/S29XS128R
Figure 2. 44-Ball Very Thin Fine-Pitch Ball Grid Array, Top View, Balls Facing Down
Notes:
1. Ball D7 is NC for S29VS128R.
2. Balls D7, C12, C4, D5, C10, D10, C11, D4 are NC for S29XS256R and S29XS128R
3
2
9
10
5
4
7
6
8
1
13
12
14
11
NC
NC
B
D
E
F
G
H
A
C
RDY
VPP
A19
VSS
A21
VCC
CLK
WE#
A22
A17
VCCQ
NC
A18
A20
A16
A23
AVD#
RESET#
VSSQ
CE#
VSS
A/DQ2
A/DQ9
A/DQ6
A/DQ7
A/DQ12
A/DQ13
A/DQ3
OE#
A/DQ8
A/DQ15
A/DQ10
VCCQ
VSSQ
A/DQ14
A/DQ4
A/DQ5
A/DQ11
A/DQ0
A/DQ1
NC
NC