Copyright
©
2013
congatec
AG
QMX6m03
8/63
Contents
1 INTRODUCTION ..................................................................... 11
2
Specifications
........................................................................... 13
2.1
Feature List .............................................................................. 13
2.2
Supported Operating Systems ................................................. 14
2.3
Mechanical Dimensions ........................................................... 14
2.4
Supply Voltage Standard Power .............................................. 15
2.4.1
Electrical Characteristics .......................................................... 15
2.4.2
Rise Time ................................................................................. 15
2.5
Power Consumption ................................................................. 16
2.5.1 Freescale
®
i.MX6 Cortex A9 1.0 GHz Single Core 512kB L2 cache
17
2.5.2 Freescale
®
i.MX6 Cortex A9 1.0 GHz Dual Lite 512kB L2 cache
17
2.5.3 Freescale
®
i.MX6 Cortex A9 1.0 GHz Dual Core 1MB L2 cache
18
2.5.4 Freescale
®
i.MX6 Cortex A9 1.0 GHz Quad Core 1MB L2 cache
18
2.5.5 Freescale
®
i.MX6 Cortex A9 1.0 GHz Quad Core 1MB L2 cache
18
2.5.6 Freescale
®
i.MX6 Cortex A9 800 MHz Single Core 512kB L2
cache (2GB eMMC) .................................................................
19
2.5.7 Freescale
®
i.MX6 Cortex A9 800 MHz Dual Lite 512kB L2 cache
(2GB eMMC) ............................................................................
19
2.5.8 Freescale
®
i.MX6 Cortex A9 800 MHz Dual Core 1MB L2 cache
(2GB eMMC) ............................................................................
19
2.5.9
Freescale
®
i.MX6 Cortex A9 800 MHz Quad Core 1MB L2 cache
(2GB eMMC) ............................................................................ 20
2.6
Supply Voltage Battery Power ................................................. 20
2.6.1
CMOS Battery Power Consumption ........................................ 20
2.7
Environmental Specifications
................................................... 21
3
Block Diagram .......................................................................... 22
4 Heatspreader ........................................................................... 23
4.1
Heatspreader Dimensions ....................................................... 24
5
Connector Subsystems ............................................................ 26
5.1
PCI Express™ ......................................................................... 27
5.2 UART/RS-232 .......................................................................... 27
5.3
Gigabit Ethernet ....................................................................... 28
5.4 SATA ........................................................................................ 28
5.5
USB 2.0 .................................................................................... 28
5.6 SD/SDIO/MMC .........................................................................
29
5.7
HDA/I2S/AC’97
........................................................................
29
5.8 LVDS ........................................................................................
29
5.9
HDMI
........................................................................................ 30
5.10 LPC/GPIO ................................................................................ 30
5.11 SPI ........................................................................................... 31
5.12
CAN Bus .................................................................................. 31
5.13
Manufacturing/JTAG Interface ................................................. 31
5.14
Power Control .......................................................................... 31
5.15
Power Management ................................................................. 33
5.16 Watchdog ................................................................................. 33
5.17
I2C Bus .................................................................................... 34
6
Additional Features .................................................................. 35
6.1
High Assurance Boot (HAB) ..................................................... 35
6.2
Dedicated Hardware Accelerators ........................................... 35
6.3
Power Management ................................................................. 35
6.4
Dynamic Voltage and Frequency Scaling ................................ 35
6.5
Smart Speed Technology ......................................................... 36
6.6
Suspend Mode ......................................................................... 36
7
ARM Technologies ................................................................... 37
7.1
Media Processing Engine (MPE-NEON) ................................ 37
7.2
Jazelle DBX ............................................................................. 37
7.3 TrustZone ................................................................................. 37
7.4
Floating Point Unit .................................................................... 37
8
conga Tech Notes .................................................................... 38
8.1 Freescale
®
i.MX6 Processor Features ..................................... 38
8.1.1
Temperature Monitor (TEMPMON) .......................................... 38
8.2
Thermal Management .............................................................. 38
8.3
Audio Mux ................................................................................
39
8.4
LVDS Bridge ............................................................................
39