202
6174B–ATARM–07-Nov-05
AT91FR40162S Preliminary
This package respects the recommendations of the NEMI User Group
21.3
Soldering Profile
gives the recommended soldering profile from J-STD-20C.
Note:
It is recomended to apply a soldering temperature higher than 250°C.
A maximum of three reflow passes is allowed per component.
Table 21-4.
Package Reference
JESD97 Classification
e1
Table 21-5.
Soldering Profile RoHS Compliant Package
Profile Feature
Convection or IR/Convection
Average Ramp-up Rate (183
°
C to Peak)
3
°
C/sec. max.
Preheat Temperature 125
°
C ±25
°
C 180
sec.
max
Temperature Maintained Above 183
°
C
60 sec. to 150 sec.
Time within 5
°
C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260
°
C
Ramp-down Rate
6
°
C/sec.
Time 25
°
C to Peak Temperature
8 min. max
Содержание AT91FR40162S
Страница 180: ...180 6174B ATARM 07 Nov 05 AT91FR40162S Preliminary Figure 19 2 MCKO Relative to NRST NRST tD MCKO...
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Страница 204: ...204 6174B ATARM 07 Nov 05 AT91FR40162S Preliminary 23 AT91FR40162S Errata There is no known errata for the AT91FR40162S...