SERVICE MANUAL
HAMAMATSU, JAPAN
1,752K-377
Printed in Japan ’02, 03
CL
001671
CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT .................................................................................. 4
CIRCUIT BOARD LAYOUT ................................................................. 6
BLOCK DIAGRAM .............................................................................. 7
DISASSEMBLY PROCEDURE ........................................................... 8
LSI PIN DESCRIPTION .................................................................... 19
IC BLOCK DIAGRAM ........................................................................ 21
CIRCUIT BOARDS ........................................................................... 23
INSPECTION .................................................................................... 33
MIDI IMPLEMENTATION CHART ..................................................... 40
20020401-158000
CLP-120
This document is printed on chlorine free (ECF) paper with soy ink.
CLP-120