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7 Series FPGAs SelectIO Resources User Guide
UG471 (v1.10) May 8, 2018
Chapter 1:
SelectIO Resources
SSTL (Stub-Series Terminated Logic)
The Stub-Series Terminated Logic (SSTL) for 1.8V (SSTL18), 1.5V (SSTL15), and 1.35V
(SSTL135) are I/O standards used for general purpose memory buses.
While example termination techniques are discussed in this section, the optimal
termination schemes for a given memory interface are determined using signal-integrity
analysis of the actual PCB topology including the memory devices used, the board layout,
and transmission line impedances. Xilinx provides both IBIS model files and encrypted
HSPICE model files for all of the I/O standards. 7 series FPGAs support these SSTL
standards for both single-ended signaling and differential signaling. The differential
versions use a true differential amplifier input buffer and complementary push-pull
output buffers. The 3-state DCI (T_DCI) versions of these standards are the preferred I/O
standards to use for memory interfaces implemented in the HP I/O banks. The IN_TERM
(untuned internal termination) attribute is recommended for interfaces implemented in
HR I/O banks.
New to the 7 series FPGAs is the option to specify the slew rate of the output buffer for all
of the memory interface related I/O standards: HSTL, SSTL, HSUL, and MOBILE_DDR.
This is similar to the Xilinx LVCMOS and LVTTL I/O standards, where both slow and fast
slew options are available. Although slow is the default setting, for most fast interface
frequencies the fast slew option is preferable. However, the optimal selection is
determined through signal-integrity analysis.
SSTL18 is defined by the JEDEC standard JESD8-15, and is used for DDR2 SDRAM
memory interfaces. The class-I driver can only be used in unidirectional topologies (no
bidirectional support). The class-II driver can be used for both for bidirectional and
unidirectional signaling. For some topologies (such as short, point-to-point interfaces), the
class-I driver can result in reduced overshoot and better signal integrity.
SSTL18 class-I and class-II are available in both the HP and HR I/O banks, with the HP
banks providing DCI and T_DCI options for tuned internal parallel split-termination
resistors. The T_DCI option is only available for bidirectional signals (no input-only or
output-only). HR banks provide IN_TERM options for untuned internal parallel
split-termination resistors. Although the optimal drive and termination scheme for any
new design is determined through careful signal-integrity analysis, initial considerations
include:
•
HP I/O banks: SSTL18_II_T_DCI at the 7 series FPGAs bidirectional pins (DQ and
DQS), and SSTL18_II at the unidirectional pins (all other pins). Use on-die termination
(ODT) at the memory device on the bidirectional signals, and external
parallel-termination resistors to V
TT
= V
CCO
/2 for the unidirectional signals.
•
HR I/O banks: SSTL18_II at the 7 series FPGAs pins for both bidirectional (DQ/DQS)
and unidirectional (all other pins) signals, combined with the IN_TERM (internal
termination) attribute on the bidirectional pins. Use ODT at the memory device on the
bidirectional signals, and external parallel-termination resistors to V
TT
= V
CCO
/2 for
the unidirectional signals.
SSTL15 is used for DDR3 SDRAM memory interfaces and is roughly defined (not by name)
in the JEDEC standard JESD79-3E. For this standard, the full-strength driver (SSTL15) is
available in both the HP and HR I/O banks. A weaker, reduced-strength driver, designated
by an R in the standard name (SSTL15_R), is available in the HR I/O banks. Both drivers
support bidirectional and unidirectional signaling. For some topologies (such as short
point-to-point interfaces), the reduced-strength driver can result in reduced overshoot and
better signal integrity. The HP I/O banks provide DCI and T_DCI options for tuned
internal parallel split-termination resistors. While the DCI option is not available for
bidirectional signals (input or output only), the T_DCI option is only available for