W25Q16BV
Publication Release Date: July 08, 2010
- 65 - Revision F
13.5
16-Pin SOIC 300-mil (Package Code SF)
GAUGE PLANE
DETAIL A
GAUGE PLANE
DETAIL A
MILLIMETERS INCHES
SYMBOL
Min Nom Max Min Nom Max
A 2.36
2.49 2.64 0.093
0.098
0.104
A1 0.10 ---
0.30 0.004 --- 0.012
A2 --- 2.31 --- --- 0.091 ---
b 0.33
0.41 0.51 0.013
0.016
0.020
C 0.18 0.23 0.28 0.007
0.009
0.011
D 10.08
10.31 10.49 0.397 0.406 0.413
E 10.01
10.31 10.64 0.394 0.406 0.419
E1 7.39 7.49 7.59 0.291 0.295 0.299
e
(2)
1.27 BSC.
0.050 BSC.
L 0.38
0.81 1.27 0.015
0.032
0.050
y --- --- 0.076 --- --- 0.003
θ
0° ---
8° 0° --- 8°
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
