W25Q16BV
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13.
PACKAGE SPECIFICATION
13.1
8-Pin SOIC 150-mil (Package Code SN)
L
θ
c
D
A1
A
e
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E H
E
4
1
5
8
L
θ
c
D
A1
A
e
b
b
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E H
E
E H
E
4
1
5
8
MILLIMETERS INCHES
SYMBOL
Min Max Min Max
A 1.35
1.75
0.053
0.069
A1 0.10
0.25
0.004
0.010
b 0.33
0.51
0.013
0.020
c 0.19
0.25
0.008
0.010
E
(3)
3.80 4.00
0.150
0.157
D
(3)
4.80 5.00
0.188
0.196
e
(2)
1.27 BSC
0.050 BSC
H
E
5.80 6.20 0.228
0.244
Y
(4)
--- 0.10 ---
0.004
L 0.40
1.27
0.016
0.050
θ
0° 10° 0° 10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
