4
4.. R
Re
es
siid
du
ua
all g
go
olld
d d
de
ep
po
os
siittiio
on
n
18
Use the 1000 ml beaker for residual gold deposition.
Place a beaker containing the exhausted gold electro-
lyte (max. 930 ml) and 20 ml brightener additive onto
the hotplate. Insert the appropriate agitator rod.
Pass two copper rods through the residual gold
sponge, pull on the shrink-fit plastic tubing up to the
sponge and shrink-fit the tubing.
In order to check the amount of residual gold you
should weigh the sponge before and after the residual
gold is deposited. The difference in weight gives you
the weight of the residual gold. The sponge can be
used several times (deposition of max. 25 g of gold
possible). The gold electrolyte may become discoloured
during the heating-up phase.
Assemble the electroforming head and the silicone seal
and pull the copper rods through the two holes at the
front of the silicone seal (Nos. 8 + 9). Push the head
onto the mount, position the residual gold sponge
(the lower end of the sponge must not be below the
anode!). Push the head onto the beaker and connect
the top ends of the copper rods to the mount (see
sketch). Make sure that the sponge does not touch the
anode and is fully immersed, if necessary top it up with
distilled water.
Press the mode button until Mode 3 (Recycle) is
displayed (operating time: 120 min), the LED above
both contacts is illuminated.
Press the Start/Stop button to activate the process. The
3-digit display now shows the total operating time. The
unit checks that the contacts are in order. If the contact
LED above the two contacts is illuminated constantly,
the contact is in order. If the LED flashes and the error
code “F0” displayed, there is no contact.
Note:
!
