Viglen CX135, User Manual, Page: 32 / 93

Viglen CX135 User Guide – Version 1.0
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Precautions
•
Use a grounded wrist strap designed to prevent static discharge.
•
Touch a grounded metal object before removing any board from its antistatic bag.
•
Handle a board by its edges only; do not touch its components, peripheral chips,
memory modules or gold contacts.
•
When handling chips or modules, avoid touching their pins.
•
Put the motherboard, add-on cards and peripherals back into their antistatic bags
when not in use.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When
unpacking the board, make sure the person handling it is static protected.
PGA Processor and heatsink Installation
Warning!
When handling the processor package, avoid placing direct pressure on the label
area of the fan. Also, do not place the motherboard on a conductive surface, which
can damage the BIOS battery and prevent the system from booting up.
Important!
Always connect the power cord last and always remove it before adding, removing or
changing any hardware components. Make sure that you install the processor into
the CPU socket
before you install the heatsink. The VIG705P can support either one
or two Intel Xeon 1MB L2 cache processors of 3.6+ GHz. If installing one processor
only, install it into CPU socket #1.
Upgrading the CPU
The new Intel Nocona processor uses a new 604-pin core package technology Micro
Pin Grid Array, or Micro-PGA. This package utilises a 604-pin zero insertion force
socket (PGA-604). Thermal solutions are attached directly to the back of the
processor core package with the use of a thermal plate or heat spreader.
When the processor is mounted in the socket 604 connector, it is secured by the ZIF
(Zero Insertion Force) socket.
The design of the VIG705P Motherboard makes it a simple job to replace or upgrade
the processors. Follow the instructions below for instructions on how to upgrade the
processors: