NORA-W36 series - System integration manual
UBX-22021120 - R01
Design-in
Page 22 of 48
C1-Public
The suggested stencil layout for the NORA-W36 module should follow the copper pad layout, as
shown in
. The assembly house should determine the thickness of the solder paste stencil
based on the entire host PCB, typically 100-120
μ
m.
Figure 7: NORA-W36 mechanical outline
3.6
Thermal guidelines
The NORA-W36 series modules have been successfully tested at -40 °C to +105 °C. A good grounding
should be observed for temperature relief during high ambient temperature.
3.7
ESD guidelines
The immunity of devices integrating NORA-W36 modules to Electro-Static Discharge (ESD) is part of
the Electro-Magnetic Compatibility (EMC) conformity, which is required for products bearing the CE
marking, compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low
Voltage Directive (73/23/EEC) issued by the Commission of the European Community.
Compliance with these directives implies conformity to the following European Norms for device ESD
immunity: ESD testing standard
CENELEC EN 61000-4-2
and the radio equipment standards
ETSI
EN 301 489-1
,
ETSI EN 301 489-7
,
ETSI EN 301 489-24
, the requirements of which are summarized
in
